Multi-layered flexible print circuit board and manufacturing method thereof

ABSTRACT

Provided is an FPC, which comprises an insulating layer  2 , wiring layers  3  and  4  laminated above and under the insulating layer  2 , and a layer connection for connecting the wiring layers  3  and  4  electrically. The layer connection is constituted to comprise: a conductor press-fit hole  5  of a cone shape extending through the insulating layer  2  and the upper and lower wiring layers  3  and  4  and expanded to the side of one wiring layer  3 ; and a conductor  6  filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer  3  deformed into the cone shape of the conductor press-fit hole  5 , and is protruded from the other wiring lower layer  4  to have its surface partially coated and jointed. As a result, the contact area between the wiring layers  3  and  4  and the conductor  6  filled in the conductor press-fit hole  5  can be enlarged to retain the contact strength between the wiring layers  3  and  4  and the conductor  6  sufficiently thereby to provide a high connection reliability for the layer connection.

BACKGROUND OF THE INVENTION

The present invention relates to a flexible print circuit board(hereinafter referred to as “FPC”) having various surface mountableelectronic parts mounted thereon and a method of producing the same andmore particularly to a multi-layered FPC having high connectionreliability and a method of producing the same.

With the recent trend for smaller size, lighter weight and higherperformance of electronic apparatus, the circuit density of FPC to beincorporated therein tends to increase more and more. As a method ofincreasing the circuit density of FPC, there is used a method involvingfine patterning of circuit layer. However, this method is limited in itscapability and leaves something to be desired. Under thesecircumstances, a multi-layered FPC obtained by laminating circuit layerson each other with an adhesive layer interposed therebetween andproviding the insulating layer between the circuit layers with aninterlayer connection structure to make three-dimensional connection ofthe circuit layers has bee noted.

Heretofore, such a multi-layered FPC has been arranged such that circuitlayers provided on the both sides of an insulating layer arethree-dimensionally connected to each other with a copper deposit layerformed on the wall of a through-hole formed in an insulating layer madeof polyimide film or the like (see, e.g., JP-A-5-175636). Thisinterlayer connection method is called plated through-hole method and ismost usually used. A through-hole method involves two major steps, i.e.,step of electrolessly plating the wall of an insulating through-hole toelectrically conduct the through-hole and step of electrolyticallyplating the through-hole to effect thick copper plating. Thethrough-hole method is advantageous in that since the copper depositlayer in the through-hole and the insulating layer in which thethrough-hole is formed are substantially the same in thermal expansioncoefficient, no exfoliation at the connection interface attributed tothe difference in thermal expansion coefficient between the copperdeposit layer in the through-hole and the insulating layer can occur,giving an excellent connection reliability against heat.

The flexible print circuit board obtained by the aforementioned platedthrough-hole method is disadvantageous in that thick copper platingcauses the rise of the thickness of not only the copper deposit layer onthe inner wall of the through-hole but also the copper foil constitutingthe electrically-conductive layer, making it difficult to finely patternthe conduct pattern of the electrically-conductive layer at thesubsequent etching step. Further, the process for interlayer connectioninvolves a number of complicated steps, leaving something to be desiredin productivity.

As an interlayer connection method for solving these problems there hasbeen proposed a method which comprises printing a solder paste in thethrough-hole after the formation of circuit layers, and then fusing andsolidifying the solder paste (see, e.g., JP-A-7-176847). This interlayerconnection method is advantageous in that as compared with the aboveproposed plate through-hole method, this method allows interlayerconnection by a simple process, making it possible to obtain a highproductivity. This interlayer connection method is also advantageous inthat since interlayer connection is effected after the formation ofcircuit layers, the process has no effects on the thickness of thecopper foil on the circuit layers, making it unlikely that the finepatterning of circuit layers can be inhibited.

In accordance with this interlayer connection method, however, whensolder disposed in the through-hole is heated, it expands thermallybeyond the insulating layer because the thermal expansion coefficient ofsolder is greater than that of the insulating layer. It is thus likelythat the difference in thermal expansion coefficient can cause thecircuit layer and the solder on the insulating layer to be peeled offeach other at the connection interface. Thus, the interlayer connectionmethod using solder leaves something to be desired in connectionreliability against heat to disadvantage.

As mentioned above, the interlayer connection in multi-layered FPC bythe related art plated through-hole method is excellent in connectionreliability but is disadvantageous in fine patterning and producibilityof circuit layer. On the other hand, the interlayer connection methodusing solder allows fine patterning of circuit layer and enhancement ofproducibility of circuit layer, which can be difficultly attained by theaforementioned through-hole method, but leaves something to be desiredin connection reliability.

It has thus been desired in the art of interlayer connection inmulti-layered FPC to provide a multi-layered FPC having a highproducibility that attains both high connection reliability and finepatterning of circuit layer and its producing method.

SUMMARY OF THE INVENTION

In the light of the aforementioned problems, an aim of the invention isto provide a multi-layered FPC having an interlayer connection betweencircuit layers having a high connection reliability and an excellentproductivity most suitable for fine patterning of circuit layer and amethod of producing same.

In order to solve the aforementioned problems, the multi-layered FPC ofthe invention comprises an insulating layer, a circuit layer formed onthe front and back surfaces of the insulating layer and a holeconnecting between the circuit layers via the insulating layer, whereinthere is provided an electrically-conductive member having a metal layerformed thereon at least on the surface thereof which is press-fittedinto the hole to electrically conduct the circuit layer.

In this arrangement, since an electrically-conductive member made of ametal layer at least on the surface thereof is used as a conductor for(electrically) connecting between circuit layers, the deformation of themetal layer on the surface of the electrically-conductive member allowsthe electrically-conductive member to make firm and close connection tothe circuit layer and the hole, making it possible to obtain a highreliability of connection between the circuit layers. Thus, in thisarrangement, a multi-layered FPC having an excellent reliability ofconnection between circuit layers can be obtained.

Further, in order to solve the aforementioned problems, the method ofproducing a multi-layered FPC of the invention comprises a one-sidedcircuit board forming step of forming a first circuit layer on one sideof a first insulating layer and insulating layer on the other sidethereof to form a first one-sided circuit board and forming a secondcircuit layer on one side of a second insulating layer to form a secondone-sided circuit board, a through-hole forming step of forming athrough-hole for connecting between the first circuit layer and thesecond circuit layer in the first one-sided circuit board in thethickness direction, a metal portion forming step of press-fitting asubstantially spherical conductor made of a metallic material at leaston the surface thereof into the through-hole to make conduction to thefirst circuit layer so that a metal portion extending from the surfaceof the first insulating layer is formed and a conducting step oflaminating the first one-sided circuit board and the second one-sidedcircuit board on each other and press-deforming the metal portion suchthat the metal portion and the second circuit layer areelectrically-conducted to each other to electrically-conduct the firstcircuit layer and the second circuit layer to each other via the metalportion.

In accordance with this producing method, the deformation of the metallayer on the surface of the electrically-conductive member allows theelectrically-conductive member to make firm and close connection to thecircuit layer and the through-hole, making it possible to obtain a highconnection reliability. Further, since interlayer connection is madeafter the formation of the circuit layer, the process has no effects onthe circuit layer. Thus, this producing method is most suitable for finepatterning of circuit layer. Moreover, since interlayer connection ismade by a very simple process involving press-fitting of a substantiallyspherical conductor and deformation of the metal layer on the surface ofthe substantially spherical conductor, this producing method ofproducing a multi-layered FPC can provide a high productivity as well.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention;

FIG. 2 is a sectional view of an essential part illustrating a part ofprocess of producing a multi-layered FPC according to an embodiment ofimplementation of the invention;

FIG. 3 is a sectional view of an essential part of a one-sidedcopper-clad laminated board with an insulating sheet which is anessential element of a multi-layered FPC according to an embodiment ofimplementation of the invention;

FIG. 4 is a sectional view of an essential part of a one-sided circuitboard with an insulating sheet having a circuit layer according to anembodiment of implementation of the invention formed thereon;

FIG. 5 is a sectional view of an essential part of a one-sided circuitboard with an insulating sheet having a through-hole according to anembodiment of implementation of the invention formed therein;

FIG. 6 is a sectional view of an essential part of a one-sided circuitboard with an insulating sheet shown at the beginning of press-fittingof a substantially spherical conductor according to an embodiment ofimplementation of the invention;

FIG. 7 is a sectional view of an essential part of a one-sided circuitboard with an insulating sheet shown during the press-fitting anddeformation of a substantially spherical conductor according to anembodiment of implementation of the invention;

FIG. 8 is a sectional view of an essential part of a one-sided circuitboard with an insulating sheet shown at the end of the press-fitting anddeformation of a substantially spherical conductor according to anembodiment of implementation of the invention;

FIG. 9 is a sectional view of an essential part of a one-sided circuitboard having an interlayer connection bump according to an embodiment ofimplementation of the invention formed thereon;

FIG. 10 is a sectional view of an essential part of a one-sided circuitboard having an interlayer connection bump formed thereon which is beinglaminated on another one-sided circuit board with an adhesive layeraccording to an embodiment of implementation of the invention interposedtherebetween;

FIG. 11 is a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention;

FIG. 12 is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention;

FIG. 13 is a sectional view of an essential part illustrating a part ofa process of producing a multi-layered FPC according to an embodiment ofimplementation of the invention;

FIG. 14 is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention;

FIG. 15 is a sectional view of an essential part of a one-sided circuitboard with an adhesive sheet which is a constituent element of amulti-layered FPC according to an embodiment of implementation of theinvention;

FIG. 16 is a sectional view of an essential part of a one-sided circuitboard with an adhesive sheet having a circuit layer according to enembodiment of implementation of the invention formed thereon;

FIG. 17 is a sectional view of an essential part of a one-sided circuitboard with an adhesive sheet having a through-hole according to anembodiment of implementation of the invention formed therein;

FIG. 18 is a sectional view of an essential part of a one-sided circuitboard with an adhesive sheet shown at the beginning of press-fitting ofa substantially spherical conductor according to en embodiment ofimplementation of the invention;

FIG. 19 is a sectional view of an essential part of a one-sided circuitboard with an adhesive sheet shown at the end of press-fitting anddeformation of a substantially spherical conductor according to anembodiment of implementation of the invention;

FIG. 20 is a sectional view of an essential part of a one-sided circuitboard having an interlayer connection bump formed thereon which is beinglaminated on another one-sided circuit board with an adhesive layeraccording to an embodiment of implementation of the invention interposedtherebetween;

FIG. 21 is a sectional view of an essential part of a multi-layered FPCwhich has been finished in lamination according to an embodiment ofimplementation of the invention;

FIG. 22 is a sectional view of an essential part of a multi-layered FPCin the course of lamination according to an embodiment of implementationof the invention;

FIG. 23 is a sectional view of an essential part of anothermulti-layered FPC which has been finished in lamination according to anembodiment of implementation of the invention;

FIG. 24 is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention;

FIG. 25 is a sectional view of an essential part of a both-sidedcopper-clad laminated board which is a constituent element of amulti-layered FPC according to an embodiment of implementation of theinvention;

FIG. 26 is a sectional view of an essential part of a both-sided circuitboard having a circuit layer according to en embodiment ofimplementation of the invention formed thereon;

FIG. 27 is a sectional view of an essential part of a both-sided circuitboard having a through-hole according to an embodiment of implementationof the invention formed therein;

FIG. 28 is a sectional view of an essential part of a both-sided circuitboard shown at the beginning of press-fitting of a resin-cored metalball according to an embodiment of implementation of the invention;

FIG. 29 is a sectional view of an essential part of a both-sided circuitboard in the course of press-fitting and deformation of a resin-coredmetal ball according to an embodiment of implementation of theinvention;

FIG. 30 is a sectional view of an essential part of a both-sided circuitboard shown at the end of press-fitting and deformation of a resin-coredmetal ball according to an embodiment of implementation of theinvention;

FIG. 31 is a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention;

FIG. 32 is a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention;

FIG. 33 is a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention;

FIG. 34 is a sectional view of an essential part of a one-sidedcopper-clad laminated board with an adhesive layer which is aconstituent element of a multi-layered FPC according to an embodiment ofimplementation of the invention;

FIG. 35 is a sectional view of an essential part of a one-sided circuitboard with an adhesive layer having a circuit layer according to anembodiment of implementation of the invention formed thereon;

FIG. 36 is a sectional view of an essential part of a one-sided circuitboard with an adhesive layer having a through-hole according to anembodiment of implementation of the invention formed therein;

FIG. 37 is a sectional view of an essential part shown at the beginningof press-fitting of a resin-cored metal ball into a multi-layeredcircuit layer having a blind via hole according to en embodiment ofimplementation of the invention formed therein;

FIG. 38 is a sectional view of an essential part of a multi-layered FPCwhich has been finished in lamination according to an embodiment ofimplementation of the invention;

FIG. 39 is a sectional view of an essential part of anothermulti-layered FPC which has been finished in lamination according to anembodiment of implementation of the invention;

FIG. 40 is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention;

FIG. 41 is a sectional view of an essential part of a both-sidedcopper-clad laminated board which is a constituent element of amulti-layered FPC according to an embodiment of implementation of theinvention;

FIG. 42 is a sectional view of an essential part of a both-sided circuitboard having a circuit layer according to an embodiment ofimplementation of the invention formed thereon;

FIG. 43 is a sectional view of an essential part of a both-sided circuitboard having a through-hole according to an embodiment of implementationof the invention formed therein;

FIG. 44 is a sectional view of an essential part of a both-sided circuitboard having a substantially spherical conductor according to anembodiment of implementation of the invention disposed thereon;

FIG. 45 is a sectional view of an essential part of a both-sided circuitboard having a substantially spherical conductor according to anembodiment of implementation of the invention press-fitted therein;

FIG. 46 is a sectional view of an essential part of a both-sided circuitboard having a solder ball according to an embodiment of implementationof the invention disposed thereon;

FIG. 47 is a sectional view of an essential part of a both-sided circuitboard having a solder ball according to an embodiment of implementationof the invention press-fitted therein;

FIG. 48 is: a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention;

FIG. 49 is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention;

FIG. 50 is a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention;

FIG. 51 is a sectional view of an essential part of a one-sidedcopper-clad laminated board with an adhesive layer which is aconstituent element of a multi-layered FPC according to an embodiment ofimplementation of the invention;

FIG. 52 is a sectional view of an essential part of a one-sided circuitboard with an adhesive layer having a circuit layer according to anembodiment of implementation of the invention formed thereon;

FIG. 53 is a sectional view of an essential part of a one-sided circuitboard with an adhesive layer having a through-hole according to anembodiment of implementation of the invention formed therein;

FIG. 54 is a sectional view of an essential part of a laminated circuitboard having a blind via hole according to an embodiment ofimplementation of the invention formed therein;

FIG. 55 is a sectional view of an essential part of a multi-layered FPCwhich has been finished in lamination according to an embodiment ofimplementation of the invention;

FIG. 56 is a sectional view of an essential part of anothermulti-layered FPC which has been finished in lamination according to anembodiment of implementation of the invention;

FIG. 57 is a side sectional view of an essential part of a flexibleprint circuit board according to an embodiment of the invention;

FIG. 58(a) is a sectional view of an essential part of a both-sidedcopper-clad laminated board to be used in the production of a flexibleprint circuit board according to an embodiment of the invention;

FIG. 58(b) is a side sectional view of an essential part illustrating aboth-sided circuit board;

FIG. 58(c) is a side sectional view illustrating a conductor press-fithole forming step;

FIG. 58(d) is a side sectional view of an essential part illustrating aconductor press-fitting step;

FIG. 58(e) is a side sectional view of an essential part illustratinghow the conductor is press-fitted into the conductor press-fit hole;

FIG. 59 is a side sectional view of an essential part of a flexibleprint circuit board according to an embodiment of the invention;

FIG. 60(a) is a side sectional view of an essential part of a one-sidedcopper-clad laminated board to be used in the production of the flexibleprint circuit board according to an embodiment of the invention;

FIG. 60(b) is a side sectional view of an essential part illustrating aboth-sided circuit board forming step;

FIG. 60(c) is a side sectional view of an essential part illustrating aboth-sided circuit board;

FIG. 61 is a sectional view of an essential part of a flexible printcircuit board according to an embodiment of the invention;

FIG. 62(a) is a side sectional view of an essential part illustrating anadhesive layer forming step;

FIG. 62(b) is a side sectional view of an essential part illustrating aconductor press-fit hole forming step;

FIG. 62(c) is a side sectional view of an essential part illustrating aone-sided circuit board sticking step;

FIG. 62(d) is a side sectional view of an essential part illustrating aconductor press-fitting step;

FIG. 62(e) is a side sectional view of an essential part illustratinghow the conductor is press-fitted into the conductor press-fit hole;

FIG. 63(a) is a side sectional view of an essential part of amulti-layered flexible print circuit board according to an embodiment ofthe invention;

FIG. 63(b) is a side sectional view of an essential part illustrating amodification of the multi-layered flexible print circuit board;

FIG. 64(a) is a sectional view of an essential portion of a double-sidedFPC according to an embodiment of the invention;

FIG. 64(b) is a sectional view of another essential portion of adouble-sided FPC according to an embodiment of the invention;

FIG. 65(a) is a sectional view of an essential portion of a double-sidedcopper-clad laminate or a raw material in embodiment of the invention;

FIG. 65(b) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which wiring layers are formed, inembodiment of the invention;

FIG. 65(c) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which a through hole is formed, inembodiment of the invention;

FIG. 65(d) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which a generally sphericalconductor is arranged, in embodiment of the invention;

FIG. 65(e) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which the generally sphericalconductor is press-fitted, in embodiment of the invention;

FIG. 65(f) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which solder particles are filled,in embodiment of the invention;

FIG. 65(g) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which the solder particles aremelted, in embodiment of the invention;

FIG. 65(h) is a sectional view of an essential portion of thedouble-sided FPC, after layer-connected, in embodiment of the invention;

FIG. 66(a) is a sectional view of an essential portion of anothersingle-sided copper-clad laminate or a raw material in embodiment of theinvention;

FIG. 66(b) is a sectional view of an essential portion of thesingle-sided copper-clad laminate, in which a wiring layer is formed, inembodiment of the invention;

FIG. 66(c) is a sectional view of an essential portion of anotherdouble-sided copper-clad laminate, in which the single-sided laminatesare adhered, in embodiment of the invention;

FIG. 66(e) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which a through hole is formed, inembodiment of the invention;

FIG. 66(e) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which a generally sphericalconductor is arranged, in embodiment of the invention;

FIG. 66(f) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which the generally sphericalconductor is press-fitted, in embodiment of the invention;

FIG. 66(g) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which a generally spherical soldermember is press-fitted, in embodiment of the invention;

FIG. 66(h) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which the generally sphericalsolder member is press-fitted, in embodiment of the invention;

FIG. 66(i) is a sectional view of an essential portion of thedouble-sided FPC, after layer-connected, in embodiment of the invention.

FIG. 67(a) is a sectional view of a multi-layer FPC laminated accordingto embodiment of the invention; and

FIG. 67(b) is a sectional view of a multi-layer FPC laminated accordingto embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of implementation of the invention will be described inconnection with the attached drawings. In the following views, where themembers are the same, the same reference numerals are used. Therefore,duplicated description will not be made. The numeral values given in thefollowing embodiments are examples of reference numerals that can beselected. The invention is not limited to these examples.

Embodiment 1

A multi-layered FPC according to en embodiment of implementation of theinvention will be described hereinafter. Firstly, the multi-layered FPCof the invention will be described in connection with FIG. 1. FIG. 1 isa side sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention.

In FIG. 1, the reference numeral 100 indicates a multi-layered FPCobtained by laminating a one-sided circuit board 104 having an uppercircuit layer 103 provided on one side of an insulating layer 102 madeof polyimide film and another one-sided circuit board 106 having a lowercircuit layer 105 with an adhesive layer 107 interposed therebetween(The upper circuit layer 103 and the lower circuit layer 105 will behereinafter occasionally referred generically to as “circuit layer”).The one-sided circuit board 104 has a through-hole 108 formed thereinextending through the insulating layer 102 and the upper circuit layer103. Though described in detail later, as shown in FIG. 2, onesubstantially spherical conductor 109 is press-fitted and deformed inthe through-hole 108 to make connection to the upper circuit layer 103and form an interlayer connection bump 110 extending from the one-sidedcircuit board 104. During the lamination of the one-sided circuit board104 and the other one-sided circuit board 106 on each other, theprotrusion of the interlayer connection bump 110 comes in contact withthe lower circuit layer 105 so that it is press-deformed to form aninterlayer conductor 111 connected to the lower circuit layer 105.Accordingly, the interlayer conductor 111 press-fitted in the interiorof the through-hole 108 allows conduction of the upper circuit layer 103to the lower circuit layer 105, i.e., electrical interlayer connectionbetween the upper circuit layer 103 and the lower circuit layer 105.

Thus, in the interlayer conductor 111 causing interlayer connection inthe multi-layered FPC 100, the interlayer connection bump 110 formed bypress-fitting one substantially spherical conductor 109 into theinterior of the through-hole 108 is connected to the upper circuit layer103 and fills the interior of the through-hole 108 compactly. Further,the interlayer connection bump 110 which has been press-deformed isconnected to the lower circuit layer 105 so that the upper circuit layer103 and the lower circuit layer 105 are electrically connected to eachother, making it possible to obtain a high connection reliability evenwith the connection of fine circuit layers.

In this arrangement, the greatest problem with interlayer connectionwith solder can be solved. In other words, a problem can be solved thatwhen a conductor made of solder alone is heated, the solder in thethrough-hole expands beyond the insulating layer to cause the circuitlayer and the solder on the surface of the insulating layer to be peeledoff each other at the junction interface, making it impossible to assurethe desired connection reliability against heat. Accordingly, theconnection configuration of the multi-layered FPC 100 according to thepresent embodiment makes it possible to obtain a high reliability inelectrical connection between the upper circuit layer 103 and the lowercircuit layer 105.

As the material of the substantially spherical conductor 109, e.g.,interlayer conductor 111 there may be used a metal. Further, thematerial of the substantially spherical conductor 109 preferablycontains at least one of soft metals. The constitution of thesubstantially spherical conductor 109 by a soft metal makes it possibleto press-fit and deform the substantially spherical conductor 109 in thethrough-hole 108 under a low pressure. Moreover, the substantiallyspherical conductor 109 can be certainly connected to the circuit layerto form a highly-conductive metal post-shaped interlayer conductor 111that fills the through-hole 108 compactly, making it possible to obtaina high connection reliability. The term “soft metal” as used herein ismeant to indicate a metal that can be used for circuit purpose amongmetals having a good conductivity that are so ductile as to undergoplastic deformation.

Specific examples of the material of the substantially sphericalconductor 109 include solder alloy, copper, copper alloy, nickel, nickelalloy, gold, silver, tin, and palladium. Preferred among these materialsare solder alloy, copper, and copper alloy. When the substantiallyspherical conductor 109 contains a solder alloy or at least one ofcopper and copper alloy, the resulting substantially spherical conductor109 is very soft and deformable, the process has no effects on thecircuit layer. Further, the interlayer connection bump 110 thus deformedcan be certainly connected to the circuit layer, making it possible toobtain a high reliability in connection to the circuit layer. Inparticular, when copper is used, the thermal expansion coefficient ofthe insulating layer 102 and the interlayer conductor 111 are the same,making it possible to obtain a high reliability against heat cyclestrain. Further, the stress developed by the difference in thermalexpansion coefficient can be relaxed by the interlayer conductor 111.Thus, the aforementioned substantially spherical conductor 109 issuitable for products requiring a high reliability. As the solderformulation of the solder alloy there may be used any of eutecticsolder, high temperature solder and lead-free solder depending on thevarious conditions.

The opening shape of the through-hole 108 in which such a substantiallyspherical conductor 109 is press-fitted is not specifically limited butis preferably circle.

A method of producing the multi-layered FPC 100 according to the presentembodiment that can realize a high reliability in electrical connectionbetween the upper circuit layer 103 and the lower circuit layer 105 byusing the aforementioned interlayer conductor 111 will be described indetail in connection with FIGS. 3 to 11. In the following views, wherethe constituent elements are the same as those in FIG. 1, the samereference numerals as in FIG. 1 are used. Detailed description of theseconstituent elements will not be made.

FIGS. 3 to 9 each are a diagram illustrating the procedure of producingthe multi-layered FPC 100 according to Embodiment 1. FIG. 3 is a sidesectional view of an essential part of a one-sided copper-clad laminatedboard with an adhesive sheet which is a constituent element of themulti-layered FPC according to an embodiment of implementation of theinvention. FIG. 4 is a sectional view of an essential part of aone-sided circuit board with an insulating sheet having a circuit layeraccording to an embodiment of implementation of the invention formedthereon. FIG. 5 is a sectional view of an essential part of a one-sidedcircuit board with an insulating sheet having a through-hole accordingto an embodiment of implementation of the invention formed therein. FIG.6 is a sectional view of an essential part of a one-sided circuit boardwith an insulating sheet shown at the beginning of press-fitting of asubstantially spherical conductor according to an embodiment ofimplementation of the invention. FIG. 7 is a sectional view of anessential part of a one-sided circuit board with an insulating sheetshown during the press-fitting and deformation of a substantiallyspherical conductor according to an embodiment of implementation of theinvention. FIG. 8 is a sectional view of an essential part of aone-sided circuit board with an insulating sheet shown at the end of thepress-fitting and deformation of a substantially spherical conductoraccording to an embodiment of implementation of the invention. FIG. 9 isa sectional view of an essential part of a one-sided circuit boardhaving an interlayer connection bump according to an embodiment ofimplementation of the invention formed thereon. FIG. 10 is a sectionalview of an essential part of a one-sided circuit board having aninterlayer connection bump formed thereon which is being laminated onanother one-sided circuit board with an adhesive layer according to anembodiment of implementation of the invention interposed therebetween.FIG. 11 is a sectional view of an essential part of a multi-layered FPCshown after interlayer connection according to an embodiment ofimplementation of the invention.

In the aforementioned views, the reference numeral 112 indicates aone-sided copper-clad laminated board with an insulating sheet having acopper foil 113 formed on one side of an insulating layer 2 and aninsulating sheet 114 formed on the other side thereof. The referencenumeral 115 indicates a one-sided circuit board with an insulating sheethaving an upper circuit layer 103 formed thereon which is obtained byetching the one-sided copper-clad laminated board 112 with an insulatingsheet. The reference numeral 116 indicates a punching die for formingthrough-hole. The reference numeral 117 indicates an upper pressureplate. The reference numeral 118 indicates a lower pressure plate. Thereference numeral 119 indicates an upper heating pressure plate. Thereference numeral 120 indicates a lower heating pressure plate.

The method of producing the multi-layered FPC 100 will be described inconnection with the attached drawings. Firstly, as shown in FIG. 3, aone-sided copper-clad laminated board 112 with an insulating sheethaving a copper foil 113 formed on one side of an insulating layer 2 andan insulating sheet 114 formed on the other side thereof is prepared.While the present embodiment is described with reference to thetwo-layer type one-sided copper-clad laminated board 112 free ofadhesive layer between the insulating layer 102 and the copper foil 113by way of example, the invention is not limited thereto. A three-layertype one-sided copper-clad laminated board with an insulating sheethaving an adhesive layer interposed between the insulating layer 102 andthe copper foil 113 or a one-sided copper-clad laminated board with aninsulating sheet having more layers may be used. The layer configurationmay be properly changed.

Subsequently, a mask material is formed on the surface of the copperfoil 113 according to a circuit pattern. The copper foil 113 is thenetched with a copper etching solution such as ferric chloride and copperchloride to obtain a one-sided circuit board 115 with an insulatingsheet having an upper circuit layer 3 formed on the other side of theinsulating layer 2 as shown in FIG. 4. The upper circuit layer 103 thusobtained cannot be affected at the subsequent steps. Accordingly, inaccordance with the method of producing a multi-layered FPC according tothe present embodiment, the reduction of the thickness of the copperfoil 113 makes it possible to exert an effect of finely patterning thecircuit layer.

Further, in the present embodiment, the one-sided circuit board 104 andthe other one-sided circuit board 106 are connected to each other asdescribed later. In this manner, one-sided etching suitable for finepatterning can be effected, making it possible to realize the uppercircuit layer 103 more finely. Accordingly, the upper circuit layer 103of the one-sided circuit board 115 with an insulating sheet obtained inthe present embodiment can be patterned more finely than the circuitlayer of an ordinary both-sided circuit board having a circuit layerformed directly on the both sides of an insulating layer.

The reason for this mechanism will be described hereinafter. Since theformation of a circuit layer on both-sided circuit board normallyrequires that the copper foil on the both sides of a both-sidedcopper-clad laminated board be etched at the same time, it is necessarythat the etching solution be uniformly applied to the both-sidedcopper-clad laminated board on both the upper and lower sides thereof.However, when the etching solution is pressure-sprayed onto theboth-sided copper-clad laminated board on both the upper and lower sidesthereof, the etching solution sprayed onto the upper side of theboth-sided copper-clad laminated board then forms a liquid stagnant thatmakes it impossible to keep the desired etching uniformity. Thus, theconditions under which the both-sided circuit board is etched are unevenand unstable, it is difficult to form a very fine circuit layer.

On the other hand, the formation of a circuit layer on the one-sidedcircuit board requires that the etching solution be sprayed onto theone-sided copper-clad laminated board (copper foil is formed on thelower side of the one-sided circuit board) only on the lower sidethereof. Thus, the etching solution forms no liquid stagnant.Accordingly, the etching conditions can be predetermined to fall withinan optimum range. Therefore, the method of forming a circuit layer onthe one-sided circuit board according to the present embodiment issuitable for the fine circuit layer.

Subsequently, the one-sided circuit board 115 with an insulating sheethaving a circuit layer formed thereon is punched using a punching die116 to form a through-hole 108 as shown in FIG. 5. Subsequently, asshown in FIG. 6, one substantially spherical conductor 109 having alarger diameter than the diameter of the through-hole 8 is disposed atthe position of the through-hole 108. Using an upper pressure plate 117and a lower pressure plate 118, the substantially spherical conductor109 is then press-fitted into the through-hole 108. In this manner, thesubstantially spherical conductor 109 begins to be press-fitted anddeformed. The substantially spherical conductor 109 is basically in theform of substantial sphere. When the conductor 109 is in the form ofsphere, it can be easily handled. Further, a metal ball (substantiallyspherical conductor 109) or a resin-cored metal ball described later canbe easily produced to advantage. The volume of the substantiallyspherical conductor 109 is predetermined to be greater than the volumeof the opening of the through-hole 108.

The disposition of the substantially spherical conductor 109 can beaccomplished by a known method involving the mounting of solder ball ona semiconductor package called BGA (Ball Grid Array). In some detail, atthe position corresponding to the through-hole 108 is prepared a suctionplate having a suction hole having a smaller diameter than the diameterof the substantially spherical conductor 109 formed therein which isconnected to a vacuum pump for adjusting the pressure in the suctionhole. Subsequently, using the suction plate, the substantially sphericalconductor 109 is sucked into the suction hole, positioned at the top ofthe through-hole 108, dropped and then positioned at the position of thethrough-hole 109. An equipment called ball mounter for performing theaforementioned operation may be used. While the present embodiment hasbeen described with reference to the case where the substantiallyspherical conductor 109 is mounted by vacuum suction, electrostaticsuction may be used.

Subsequently, as shown in FIG. 7, using the upper pressure plate 117 andthe lower pressure plate 118, the substantially spherical conductor 109is pressed so that it is sequentially press-fitted into the through-hole108. Since the substantially spherical conductor 109 is made of amaterial containing a soft metal such as solder alloy, copper and copperalloy, the substantially spherical conductor 109 is sequentiallydeformed while being press-fitted in the course of press-fitting.Subsequently, the substantially spherical conductor 109 is deformedalong the inner wall of the through-hole 108 while being connected to apart of the upper circuit layer 103 so that the interior of thethrough-hole 108 is sequentially filled compactly with the substantiallyspherical conductor 109.

Subsequently, as shown in FIG. 8, the substantially spherical conductor109 comes in contact with the lower pressure plate 118 to undergodeformation. Thus, the press-fitting and deformation of thesubstantially spherical conductor 109 in the through-hole 108 isfinished. Subsequently, the upper pressure plate 117 and the lowerpressure plate 118 are detached and the insulating sheet 114 is removed.As a result, a one-sided circuit board 104 having an interlayerconnection bump 110 extending from the other side of the insulatinglayer 102 (side opposite the upper circuit layer 103) as shown in FIG. 9is obtained.

Subsequently, as shown in FIG. 10, the other one-sided circuit board 106having a lower circuit layer 105 formed on one side thereof and theone-sided circuit board 104 having an interlayer connection bump 110formed thereon are laminated on each other with an adhesive layer 107interposed therebetween. The lower circuit layer 105 provided on theother one-sided circuit board 106 cannot be affected at the subsequentsteps. Accordingly, in accordance with the method of producing amulti-layered FPC according to the present embodiment, the reduction ofthe thickness of the copper foil 113 makes it possible to exert aneffect of finely patterning of the circuit layer.

The other one-sided circuit board 106 having a lower circuit layer 105formed thereon, too, can be sprayed with the etching solution on thelower side of the one-sided copper-clad laminated board (copper foil isformed on the lower side of the one-sided circuit board) to form a lowercircuit layer 105 similarly to the one-sided circuit board 104 having anupper circuit layer 103 formed thereon. In other words, the lowercircuit layer 105 is finely patterned similarly to the upper circuitlayer 103.

Subsequently, when the laminate is heated under pressure using the upperheating pressure plate 119 and the lower heating pressure plate 120, theinterlayer connection bump 110 is connected to the lower circuit layer105 to form an interlayer conductor 111 which is electrically connectedto the lower circuit layer 105. In this manner, a multi-layered FPC 100having the upper circuit layer 103 and the lower circuit layer 105connected to each other with the interlayer conductor 111 interposedtherebetween, i.e., having a fine circuit layer comprising the uppercircuit layer 103 and the lower circuit layer 105 electrically conductedto each other as shown in FIG. 11 can be obtained by a very simpleprocess.

While the present embodiment has been described with reference to thecase where the ball diameter of the substantially spherical conductor109 is greater than the diameter of the through-hole 108, the balldiameter of the substantially spherical conductor 109 may be the same asthe diameter of the through-hole 108 In this case, too, the circuitlayers can be connected to each other by the deformation of thesubstantially spherical conductor 109. However, taking into account themargin of deformation of the substantially spherical conductor 109 andthe certainty of interlayer connection, the diameter of thesubstantially spherical conductor 109 is preferably greater than thediameter of the through-hole 108.

The aforementioned method of producing a multi-layered FPC according tothe present embodiment has the following characteristics. Firstly, sinceas the substantially spherical conductor 109 for forming the interlayerconductor 111 that makes interlayer connection there is used a softmetal, the substantially spherical conductor 109 can be easilypress-fitted and deformed in the through-hole 108 under a low pressure,making it assured that the substantially spherical conductor 109 can beconnected to the circuit layer. In this manner, a highly-conductivemetal post-shaped interlayer conductor 111 that fills the through-hole108 compactly, making it possible to obtain a high reliability inelectrical connection between the upper circuit layer 103 and the lowercircuit layer 105. In particular, when the substantially sphericalconductor 109 is made of copper, the stress developed by the differencein thermal expansion coefficient can be relaxed by the interlayerconductor 111, making it possible to obtain a high connectionreliability.

Further, since the formation of the circuit layer is followed by theconnection between the upper circuit layer 103 and the lower circuitlayer 105, the process has no effects on the circuit layer. Accordingly,the reduction of the thickness of the copper foil 113 makes it possibleto exert an effect of finely patterning the circuit layer. Thus, thisprocess is suitable for the fine patterning of circuit layer. Further,since the interlayer connection between the upper circuit layer 103 andthe lower circuit layer 105 can be made by a very simple processinvolving the press-fitting of the substantially spherical conductor 109and the lamination and contact bonding of the one-sided circuit board104 having an interlayer connection bump 110 and the other one-sidedcircuit board 106, the number of required steps is less than otherinterlayer connection methods, providing excellent productivity andproduction cost.

Accordingly, in accordance with the method of producing a multi-layeredFPC according to the present embodiment, a multi-layered FPC having ahigh reliability of connection between circuit layers which is mostsuitable for fine patterning of circuit layer can be prepared at a goodproductivity.

While the aforementioned description has been made with reference to thecase where the substantially spherical conductor 109 is made of metalmaterial alone, the substantially spherical conductor 109 may be aresin-cored metal ball having a resin ball having a smaller diameterthan the through-hole 108 as a core and a surface metal coat layer. Thecase where the resin-cored metal ball is used will be describedhereinafter in connection with FIGS. 12 and 13. In FIG. 12, thereference numeral 100 indicates a multi-layered FPC obtained bylaminating a one-sided circuit board 104 having an upper circuit layer103 provided on one side of an insulating layer 102 made of polyimidefilm and another one-sided circuit board 106 having a lower circuitlayer 105 on each other with an adhesive layer 107 interposedtherebetween. The one-sided circuit board 104 has a through-hole 108formed therein extending through the insulating layer 102 and the uppercircuit layer 103. The one-sided circuit board 104 is obtained, as shownin FIG. 13, by press-fitting and deforming one resin-cored metal ball130 having a resin ball 131 having a smaller diameter than the diameterof the through-hole 108 as a core and a surface metal coat layer 132into the through-hole 108 so that the substantially spherical conductor109 is connected to the upper circuit layer 103 to form an interlayerconnection bump 133 extending from the one-sided circuit board 104.Subsequently, during the lamination of the one-sided circuit board 104and the other one-sided circuit board 106 on each other, the protrusionof the interlayer connection bump 133 comes in contact with the lowercircuit layer 105 to undergo deformation under pressure. Thus, aninterlayer conductor 134 connected to the lower circuit layer 105 isformed. Accordingly, the interlayer conductor 134 press-fitted into theinterior of the through-hole 108 allows conduction of the upper circuitlayer 103 to the lower circuit layer 105, i.e., electrical interlayerconnection between the upper circuit layer 103 and the lower circuitlayer 105.

Since the resin-cored metal ball 130 has a resin ball 131 in the coreportion thereof, the Young's modulus of the interlayer conductor 134 canbe lowered. Thus, the stress developed by the difference in thermalexpansion coefficient can be relaxed by the resin ball 131. The resinball 131, which is a sphere, can be easily handled. The use of the resinball 131 is also advantageous in that the producibility of the ballmember is excellent. Further, the deformation of the metal layer 132 onthe surface of the resin-cored metal ball makes it possible to form theinterlayer connection bump 133 having the resin-cored metal ball 130packed closely and compactly in the through-hole 108. In thisarrangement, the interlayer conductor 134 having the resin ball 131provided therein makes it assured that the upper circuit layer 103 andthe lower circuit layer 105 can be connected to each other. Thus, theupper circuit layer 103 and the lower circuit layer 105 can be certainlyelectrically connected or conducted to each other via the interlayerconductor 134. The aforementioned multi-layered FPC comprising theresin-cored metal ball 131 can be prepared in the same manner as theaforementioned method of producing a multi-layered FPC except that theresin-cored metal ball 130 is press-fitted into the through-hole 108 asa substantially spherical conductor to form the interlayer connectionbump 133 and the interlayer connection bump 133 is used to form theinterlayer conductor 134.

Embodiment 2

Embodiment 2 will be described in detail with reference to a method ofproducing a multi-layered FPC according to another embodiment ofimplementation of the invention excellent in reliability of connectionbetween circuit layers and fine patterning of circuit layer at a goodproductivity in connection with FIGS. 14 to 20. FIG. 14 is a sectionalview of an essential part of a multi-layered FPC according to anembodiment of implementation of the invention. FIG. 15 is a sectionalview of an essential part of a one-sided circuit board with an adhesivesheet which is a constituent element of a multi-layered FPC according toan embodiment of implementation of the invention. FIG. 16 is a sectionalview of an essential part of a one-sided circuit board with an adhesivesheet having a circuit layer according to en embodiment ofimplementation of the invention formed thereon. FIG. 17 is a sectionalview of an essential part of a one-sided circuit board with an adhesivesheet having a through-hole according to an embodiment of implementationof the invention formed therein. FIG. 18 is a sectional view of anessential part of a one-sided circuit board with an adhesive sheet shownat the beginning of press-fitting of a substantially spherical conductoraccording to en embodiment of implementation of the invention. FIG. 19is a sectional view of an essential part of a one-sided circuit boardwith an adhesive sheet shown at the end of press-fitting and deformationof a substantially spherical conductor according to an embodiment ofimplementation of the invention. FIG. 20 is a sectional view of anessential part of a one-sided circuit board having an interlayerconnection bump formed thereon which is being laminated on anotherone-sided circuit board with an adhesive layer according to anembodiment of implementation of the invention interposed therebetween.

In the aforementioned views, the reference numeral 200 indicates amulti-layered FPC having a circuit layer provided on the both sides of alaminate of a one-sided circuit board 124 with an adhesive sheet havingan interlayer connection bump 110 formed thereon and another one-sidedcircuit board 125 having an interlayer connection bump formed thereon.The reference numeral 121 indicates a one-sided copper-clad laminatedboard with an adhesive sheet having a copper foil 113 formed on one sideof an insulating layer 102 and a adhesive sheet 122 formed on the otherside thereof. The reference numeral 123 indicates a one-sided circuitboard with an adhesive sheet obtained by etching the one-sidedcopper-clad laminated board 121 with an adhesive sheet to form an uppercircuit layer 103. The reference numeral 124 indicates a one-sidedcircuit board with an adhesive sheet having an interlayer connectionbump 110 formed thereon. The reference numeral 125 indicates anotherone-sided circuit board having an interlayer connection bump laminatedon the one-sided circuit board 124 with an adhesive sheet having theinterlayer connection bump 110 formed thereon. The reference numeral 126indicates an interlayer conductor formed by the connection of twointerlayer connection bumps 110. The reference numeral 116 indicates apunching die for forming a through-hole. The reference numeral 117indicates an upper pressure plate. The reference numeral 118 indicates alower pressure plate. The reference numeral 119 indicates an upperheating pressure plate. The reference numeral 120 indicates a lowerheating pressure plate.

In the multi-layered FPC 200 according to the present embodiment, theinterlayer conductor 126 press-fitted in the interior of thethrough-hole 108 allows electrical interlayer connection between theupper circuit layer 103 and the lower circuit layer 105 as shown in FIG.14. The interlayer conductor 126 is formed by the connection ofinterlayer connection bumps 110 obtained by pressing one substantiallyspherical conductor 109 in the direction along the thickness of theinsulating layer 12 as described later so that it is deformed.

As mentioned above, the interlayer conductor 126 causing the interlayerconnection in the multi-layered FPC 200 is arranged such that theinterlayer connection bump 110 formed by press-fitting the substantiallyspherical conductor 109 into the interior of the through-hole 108 isconnected to the upper circuit layer 103 and the lower circuit layer 105and fills the interior of the through-hole 108 compactly as inEmbodiment 1. In this arrangement, the upper circuit layer 103 and thelower circuit layer 105 are electrically connected to each other via theinterlayer conductor 126, making it possible to obtain a high connectionreliability even with the connection of fine circuit layers.

Thus, the greatest problem with the case where solid is used to makeinterlayer connection can be solved even with the multi-layered FPC 200according to Embodiment 2. In other words, a problem can be solved thatwhen a conductor made of solder alone is heated, the solder in thethrough-hole expands beyond the insulating layer to cause the circuitlayer and the solder on the surface of the insulating layer to be peeledoff each other at the junction interface, making it impossible to assurethe desired connection reliability against heat. Accordingly, theconnection configuration of the multi-layered FPC 200 according to thepresent embodiment makes it possible to obtain a high reliability inelectrical connection between the upper circuit layer 103 and the lowercircuit layer 105.

The use of a soft metal, particularly at least one of solder alloy,copper and copper alloy, as the material of the interlayer conductor 126as in Embodiment 1 makes it possible to obtain a higher reliability ininterlayer connection between the upper circuit layer 103 and the lowercircuit layer 105. This is because copper and copper alloy match mostfairly with the substrate (insulating layer) in thermal expansioncoefficient.

A method of the multi-layered FPC 200 according to Embodiment 2 that canrealize such a high connection reliability will be described in detailin connection with the attached drawings.

Firstly, a one-sided copper-clad laminated board 121 with an adhesivesheet having a copper foil 113 formed directly on one side of aninsulating layer 102 and an adhesive sheet 122 formed on the other sidethereof as shown in FIG. 15 is prepared. While the present embodimenthas been described with reference to the one-sided copper-clad laminatedboard 121 free of adhesive layer between the insulating layer 102 andthe copper foil 113 by way of example, the invention is not limitedthereto. A one-sided copper-clad laminated board with an insulatingsheet having an adhesive layer interposed between the insulating layer102 and the copper foil 113 or a one-sided copper-clad laminated boardwith an insulating sheet having more layers may be used. The layerconfiguration may be properly changed.

Subsequently, a mask material is formed on the surface of the copperfoil 113 according to a circuit pattern. The copper foil 113 is thenetched with a copper etching solution such as ferric chloride and copperchloride to obtain a one-sided circuit board 123 with an insulatingsheet having an upper circuit layer 103 formed on the other side of theinsulating layer 2 as shown in FIG. 16. In the present embodiment, twosheets of one-sided circuit boards 123 with an adhesive sheet areconnected to each other as described above to form a both-sided circuitboard. In this manner, one-sided etching suitable for fine patterningcan be effected, making it possible to pattern the upper circuit layer103 more finely. Accordingly, the upper circuit layer 103 of theone-sided circuit board 123 with an insulating sheet obtained in thepresent embodiment can be patterned more finely than the circuit layerof an ordinary both-sided circuit board having a circuit layer formeddirectly on the both sides of an insulating layer. The reason for thismechanism is the same as in Embodiment 1 above and will not be describedin detail.

Subsequently, the one-sided circuit board 123 with an insulating sheethaving a circuit layer 103 formed thereon is punched using a punchingdie 116 to form a through-hole 108 as shown in FIG. 17. Subsequently, asshown in FIG. 18, one substantially spherical conductor 109 having alarger diameter than the diameter of the through-hole 108 is disposed atthe position of the through-hole 108. Using an upper pressure plate 117and a lower pressure plate 118, the substantially spherical conductor109 is then press-fitted into the through-hole 108. In this manner, thesubstantially spherical conductor 109 begins to be press-fitted anddeformed. The volume of the substantially spherical conductor 109 ispredetermined to be greater than the volume of the opening of thethrough-hole 108.

Subsequently, as shown in FIG. 19, the substantially spherical conductor109 comes in contact with the lower pressure plate 118 to undergodeformation. Thus, the press-fitting and deformation of thesubstantially spherical conductor 109 in the through-hole 108 isfinished. As a result, a one-sided circuit board 124 with an adhesivesheet having an interlayer connection bump 110 formed thereon isobtained. The interlayer connection bump 110 extends from the one-sidedcircuit board 124 with an adhesive sheet beyond the upper circuit layer103 and the adhesive sheet 122 to fill the interior of the through-hole108 compactly.

Subsequently, as shown in FIG. 20, the other one-sided circuit board 125having the interlayer connection bump 110 formed thereon and theone-sided circuit board 124 having the interlayer connection bump 110formed thereon are laminated on each other with the circuit layer of thetwo one-sided circuit boards disposed outside. The laminate is thenheated under pressure using the upper heating pressure plate 119 and thelower heating pressure plate 120. During this procedure, the twoone-sided circuit boards are disposed in such an arrangement that theinterlayer connection bump 110 of the one-sided circuit board 124 withan adhesive sheet and the interlayer connection bump 110 of the otherone-sided circuit board 125 come in contact with each other. In thisarrangement, an interlayer conductor 126 having two interlayerconnection bumps electrically connected to each other is formed. Thus, amulti-layered FPC 200 which is a both-sided circuit board having theupper circuit layer 103 and the lower circuit layer 105 connected toeach other with the interlayer conductor 126 as shown in FIG. 14 isobtained.

The other one-sided circuit board 125 having a lower circuit layer 105formed thereon, too, can be sprayed with the etching solution on thelower side of the one-sided copper-clad laminated board (copper foil isformed on the lower side of the one-sided circuit board) to form a lowercircuit layer 105 similarly to the one-sided circuit board 124 with anadhesive sheet having an upper circuit layer 103 formed thereon. Inother words, the lower circuit layer 105 is finely patterned similarlyto the upper circuit layer 103.

In accordance with the aforementioned method of producing amulti-layered FPC according to Embodiment 2, one-sided circuit boardsare laminated on each other, making it possible to pattern the circuitlayer more finely than in the case where an ordinary both-sided circuitboard is used. Further, since the formation of interlayer connectionbump and the formation of adhesive layer are effected at once, theprocess can be simplified, making it possible to assure a highproductivity.

Further, the interlayer connection bumps 110 to be connected are pressedand deformed by each other to raise the connection area as well as thebonding strength thereof. Moreover, the action of the adhesive sheet 122makes it possible to keep them connected. Accordingly, even when givenvarious external stresses, the circuit layer and theelectrically-conductive member can be prevented from being peeled offeach other at the connection interface, making it possible to makeinterlayer connection with a higher reliability. Thus, the presentembodiment, too, can provide a multi-layered FPC having a highreliability of connection between circuit layers which is most suitablefor fine patterning of circuit layer at a high productivity.

The interposition of solder metal between the interlayer connectionbumps 110 at the interface makes it possible to raise further thebonding strength. In other words, in accordance with this productionmethod, when a substantially spherical conductor having solder alloyincorporated therein in the surface thereof is used to form theinterlayer connection bump 110, the solder alloy in the surface of theinterlayer connection bumps 110 come in contact with each other duringthe connection of the two interlayer connection bumps 110 to each other,making it easy for the interlayer connection bump 110 to bepressure-deformed on the surface of the circuit layer. It is thusassured that the interlayer connection bump 110 and the circuit layercan be electrically connected to each other to obtain a high connectionreliability. Further, the connection portion is made of solder alloy.Accordingly, when the laminate is heated and cooled with the interlayerconnection bumps in contact with each other, the solder is fused andsolidified to cause the interlayer connection bumps 1110 to be easilyconnected to each other, making it possible to further enhance theconnection reliability.

Embodiment 3

Embodiment 3 will be described hereinafter with reference to amulti-layered FPC according to the invention obtained by furtherlaminating the aforementioned multi-layered FPC. FIG. 21 is a sectionalview of an essential part of a multi-layered FPC which has been finishedin lamination according to an embodiment of implementation of theinvention. FIG. 22 is a sectional view of an essential part of amulti-layered FPC in the course of lamination according to an embodimentof implementation of the invention. FIG. 23 is a sectional view of anessential part of another multi-layered FPC which has been finished inlamination according to an embodiment of implementation of theinvention.

Firstly, in FIG. 21, the reference numeral 300 indicates a multi-layeredFPC obtained by laminating the multi-layered FPC 100 a produced by theaforementioned method of producing a multi-layered FPC according toEmbodiment 1 and the one-sided circuit boards 24 a, 24 b, 24 c and 24 dwith an adhesive sheet comprising an interlayer connection bump formedin the course of the aforementioned method of producing a multi-layeredFPC according to Embodiment 2 on each other. In the multi-layered FPC300, the multi-layered FPC 100 a and the one-sided circuit boards 124 a,124 b, 124 c and 124 d with an adhesive sheet have no complete trace ofthe original form and thus are represented by a parenthesized numerallike (100 a) in FIG. 21. In the multi-layered FPC 300, the multi-layeredFPC 100 a and the one-sided circuit boards 124 a, 124 b, 124 c and 124 dwith an adhesive sheet having an interlayer connection bump formedthereon, which are constituent members of the multi-layered FPC 300,have fine circuit layers with a high reliability in connectiontherebetween. Accordingly, even the multi-layered FPC 300, whichcomprises more circuit layers than in Embodiments 1 and 2, provides ahigh reliability in interlayer connection as well as an excellentfineness in the circuit layer. Further, the provision of the interlayerconductor 111 b allows connection between various adjacent circuitlayers in the multi-layered FPC 100 a and the one-sided circuit boards124 a, 124 b, 124 c and 124 d.

In order to prepare the aforementioned multi-layered FPC 300, themulti-layered FPC 100 a produced in Embodiment 1 above and the one-sidedcircuit boards 124 a, 124 b, 124 c and 124 d with an adhesive sheetcomprising an interlayer connection bump formed in the course of theaforementioned method of producing a multi-layered FPC according toEmbodiment 2 are laminated on each other in this order in such anarrangement the interlayer conductor 111 a and the interlayer connectionbumps 110 a, 110 b, 110 c and 110 d come in contact with each other asshown in FIG. 22. Subsequently, the laminate is heated under pressureusing the upper heating pressure plate 19 and the lower heating pressureplate 20 so that the components are bonded to each other. In thismanner, the interlayer connection bumps 110 a, 110 b, 110 c and 110 dare deformed to connect to the circuit layer and the interlayerconductor 111 a. Further, the provision of the adhesive sheets 122 a,122 b, 122 c and 122 d causes the multi-layered FPC 100 a and theone-sided circuit boards 124 a, 124 b, 124 c and 124 d with an adhesivesheet to be bonded to each other. Thus, a multi-layered FPC 300 havingmore circuit layers is obtained as shown in FIG. 21. The method ofproducing a multi-layered FPC 100 a and the one-sided circuit boards 124a, 124 b, 124 c and 124 d with an adhesive sheet are the same asmentioned above and thus will not be described in detail.

In accordance with this production method, when a substantiallyspherical conductor having solder alloy incorporated therein in thesurface thereof is used to form the interlayer connection bumps 110 a,110 b, 110 c and 110 d, the solder alloy in the surface of theinterlayer connection bumps 110 a, 110 b, 110 c and 110 d come incontact with each other during the connection of the two interlayerconnection bumps 110 to each other, making it easy for the interlayerconnection bumps to be pressure-deformed on the surface of the circuitlayer. It is thus assured that the interlayer connection bumps and thecircuit layer can be electrically connected to each other to obtain ahigh connection reliability. Further, the connection portion is made ofsolder alloy. Accordingly, when the laminate is heated and cooled withthe interlayer connection bumps in contact with each other, the solderis fused and solidified to cause the interlayer connection bumps 110 a,110 b, 110 c and 110 d to be easily connected to each other, making itpossible to further enhance the connection reliability.

In FIG. 23, the reference numeral 400 indicates a multi-layered FPCobtained by laminating the multi-layered FPC 100 b produced by theaforementioned method of producing a multi-layered FPC according toEmbodiment 1 and the multi-layered FPC 200 a, 200 b and 200 c on eachother with adhesive layers 127, 128 and 129 interposed therebetween,respectively. In the multi-layered FPC 400, the multi-layered FPC 100 band the multi-layered 200 a, 200 b and 200 c have fine circuit layerswith a high reliability in connection therebetween. Accordingly, eventhe multi-layered FPC 400, which comprises more circuit layers than inEmbodiments 1 and 2, provides a high reliability in interlayerconnection as well as an excellent fineness in circuit layer.

In order to prepare the aforementioned multi-layered FPC 400, themulti-layered FPC 100 b and the multi-layered FPC 200 a produced inEmbodiment 1 above are laminated on and bonded to each other with anadhesive layer 127 interposed therebetween. The multi-layered FPCcomprising the two multi-layered FPC 100 b and 200 a laminated on eachother and the multi-layered FPC 200 b produced in Embodiment 2 above arethen laminated on and bonded to each other with an adhesive layer 128interposed therebetween. The multi-layered FPC comprising the threemulti-layered FPC 100 b, 200 a and 200 b laminated on each other and themulti-layered FPC 200 c produced in Embodiment 2 above are thenlaminated on and bonded to each other with an adhesive layer 129interposed therebetween. In this manner, a multi-layered FPC 400 havingmore circuit layers can be obtained. The method of producing themulti-layered FPC 100 b and the multi-layered FPC 200 a, 200 b and 200 care the same as mentioned above and thus will not be described indetail. The order of lamination of the aforementioned components may bearbitrary.

The multi-layered FPC 300 and 400 according to the present embodimentthus obtained are formed by further laminating multi-layered FPC havingfine circuit layers connected to each other with a high reliability andthus provide a high reliability in interlayer connection and anexcellent fineness in circuit layers. Since the interlayer connection ofmulti-layered FPC, too, is carried out by the use of the aforementionedconductor, the interlayer connection material doesn't need to be newlyused, making it possible to obtain a higher productivity. Accordingly,the present embodiment, too, can provide a multi-layered FPC having ahigh reliability in interlayer connection which is most suitable forfineness of circuit layers at a high productivity.

Embodiment 4

A multi-layered FPC according to an embodiment of implementation of theinvention will be described hereinafter. Firstly, the multi-layered FPCof the invention will be described in connection with FIG. 24. FIG. 24is a sectional view of an essential part of a multi-layered FPCaccording to Embodiment 4.

In FIG. 24, the reference numeral 2100 indicates a multi-layered FPCaccording to the present embodiment having an upper circuit layer 203and a lower circuit layer 204 formed on the both sides of an insulatinglayer 202 made of polyimide film. With a conductor 206 press-fitted inthe interior of the through-hole 205, electrical interlayer connectionis established between the upper circuit layer 203 and the lower circuitlayer 204. The conductor 206 is formed by pressing one resin-cored metalball 209 having a resin ball 207 having a smaller diameter than thediameter of the through-hole 205 as a core portion and a surface metalcoat layer 208 formed on the surface thereof in the direction along thethickness of the insulating layer 202 as described later so that themetal coat layer 208 on the surface of the resin-cored metal ball 209 isdeformed to allow the resin-cored metal ball 209 to be press-fitted intothe through-hole 205.

Thus, the conductor 206 that causes interlayer connection in themulti-layered FPC 2100 has the resin ball 207 provided in the corethereof. In this arrangement, the Young's modulus of the interlayerconductor 206 can be lowered, making it possible for the resin ball 207to relax the stress developed by the difference in thermal expansioncoefficient between the insulating layer 202 and the conductor 206. Theresin ball 207, which is a sphere, can be easily handled. The use of theresin ball 207 is also advantageous in that the producibility of theball member is excellent. Further, the deformation of the metal layer208 on the surface of the resin-cored metal ball 209 makes it possibleto dispose the resin-cored metal ball 209 (conductor 206) in thethrough-hole 205 with the resin-cored metal ball 209 in contact with theupper circuit layer 203 and the lower circuit layer 204 and in closecontact with the through-hole 205. As a result, in the multi-layered FPC2100, the upper circuit layer 203 and the lower circuit layer 204 can becertainly electrically connected or conducted to each other via theresin-cored metal ball 209 (conductor 206).

In this arrangement, the greatest problem with interlayer connectionwith solder can be solved. In other words, a problem can be solved thatwhen a conductor made of solder alone is heated, the solder in thethrough-hole expands beyond the insulating layer to cause the circuitlayer and the solder on the surface of the insulating layer to be peeledoff each other at the junction interface, making it impossible to assurethe desired connection reliability against heat. Accordingly, theconnection configuration of the multi-layered FPC 2100 according to thepresent embodiment makes it possible to obtain a high reliability inelectrical connection between the upper circuit layer 203 and the lowercircuit layer 204.

When the metal layer 208 on the surface of the resin-cored metal ball209 is made of at least one of soft metals, only the metal layer 208 onthe surface of the resin-cored metal ball 209 can be deformed withoutgiving any damage to the resin ball 207, making it possible to obtain ahigher reliability in electrical connection between the upper circuitlayer 203 and the lower circuit layer 204. The term “soft metal” as usedherein is meant to indicate a metal that can be used for circuitingpurpose among metals having a good conductivity that are so ductile asto undergo plastic deformation. From the standpoint of producibility ofthe resin-cored metal ball 209, this soft metal can be preferablydeposited on the surface of the resin core by plating method. However,the invention is not limited to plating method. Specific examples of thesoft metal employable herein include solder alloy, copper, copper alloy,nickel, nickel alloy, gold, silver, and palladium. Preferred among thesesoft metals are solder alloy, copper, and copper alloy. As the solderformulation of solder alloy there may be used any solder material suchas eutectic solder, high temperature solder and lead-free solder. Anysolder material may be used depending on the conditions.

The opening shape of the through-hole in which such a resin-cored metalball 209 is press-fitted is not specifically limited but is preferablycircle.

A method of producing the multi-layered FPC 2100 according to thepresent embodiment that can realize a high reliability in electricalconnection between the upper circuit layer 203 and the lower circuitlayer 204 by using the aforementioned resin-cored metal ball 209 will bedescribed in detail in connection with FIGS. 25 to 31. In the followingviews, where the constituent elements are the same as those in FIG. 24,the same reference numerals as in FIG. 24 are used. Detailed descriptionof these constituent elements will not be made.

FIGS. 25 to 31 each are a diagram illustrating the procedure ofproducing the multi-layered FPC 2100 according to Embodiment 4. FIG. 25is a sectional view of an essential part of a both-sided copper-cladlaminated board which is a constituent element of a multi-layered FPCaccording to an embodiment of implementation of the invention. FIG. 26is a sectional view of an essential part of a both-sided circuit boardhaving a circuit layer according to en embodiment of implementation ofthe invention formed thereon. FIG. 27 is a sectional view of anessential part of a both-sided circuit board having a through-holeaccording to an embodiment of implementation of the invention formedtherein. FIG. 28 is a sectional view of an essential part of aboth-sided circuit board shown at the beginning of press-fitting of aresin-cored metal ball according to an embodiment of implementation ofthe invention. FIG. 29 is a sectional view of an essential part of aboth-sided circuit board in the course of press-fitting and deformationof a resin-cored metal ball according to an embodiment of implementationof the invention. FIG. 30 is a sectional view of an essential part of aboth-sided circuit board shown at the end of press-fitting anddeformation of a resin-cored metal ball according to an embodiment ofimplementation of the invention. FIG. 31 is a sectional view of anessential part of a multi-layered FPC shown after interlayer connectionaccording to an embodiment of implementation of the invention. FIG. 32is a sectional view of an essential part of a multi-layered FPC shownafter interlayer connection according to an embodiment of implementationof the invention.

In the aforementioned views, a both-sided copper-clad laminated board210 is a both-sided copper-clad laminated board having a copper foil 211formed directly on both sides of an insulating layer 202. A both-sidedcircuit board 212 is a both-sided circuit board obtained by etching theboth-sided copper-clad laminated board 210 to form an upper circuitlayer 203 and a lower circuit layer 204. A punching die 213 is used toform a through-hole 205. An upper pressure plate 214 and a lowerpressure plate 15 are used to press-fit and deform the resin-cored metalball 209.

A method of producing a multi-layered FPC 2100 will be describedhereinafter in connection with the attached drawings. Firstly, aboth-sided copper-clad laminated board 210 having a copper foil 211formed directly on both sides of an insulating layer 202 as shown inFIG. 25 is prepared. While the present embodiment is described withreference to the two-layer type both-sided copper-clad laminated board210 free of adhesive layer between the insulating layer 202 and thecopper foil 211 by way of example, the invention is not limited thereto.A three-layer type both-sided copper-clad laminated board having anadhesive layer interposed between the insulating layer 202 and thecopper foil 211 or a both-sided copper-clad laminated board having morelayers may be used. The layer configuration may be properly changed.

Subsequently, a mask material is formed on the surface of the copperfoil 211 according to a circuit pattern. The copper foil 211 is thenetched with a copper etching solution such as ferric chloride and copperchloride to obtain a both-sided circuit board 212 having an uppercircuit layer 203 and a lower circuit layer 204 formed on the respectiveside of the insulating layer 202 as shown in FIG. 26 (The upper circuitlayer 203 and the lower circuit layer 204 will be hereinafteroccasionally referred generically to as “circuit layer”).

Subsequently, the one-sided circuit board 212 having a circuit layerformed thereon is punched using a punching die 213 to form athrough-hole 205 as shown in FIG. 27. Subsequently, as shown in FIG. 28,one resin-cored metal ball 209 is disposed at the position of thethrough-hole 205. Using an upper pressure plate 214 and a lower pressureplate 215, the resin-cored metal ball 209 is then press-fitted into thethrough-hole 205. In this manner, the resin-cored metal ball 209 beginsto be press-fitted and deformed.

The resin-cored metal ball 209 is in the form of sphere. When theconductor 209 is in the form of sphere, it can be easily handled.Further, a resin-cored metal ball can be easily produced to advantage.The diameter of the resin ball 207 which is the core of the resin-coredmetal ball 209 is predetermined to be smaller than the diameter of thethrough-hole 205. Further, the metal layer 208 on the surface of theresin-cored metal ball 209 is made of at least one of soft metals suchas solder alloy, copper and copper alloy as described above. In thisarrangement, only the metal layer 208 on the surface of the resin-coredmetal ball 209 can be deformed without giving any damage to the resinball 207. Referring to the entire resin-cored metal ball 209, thediameter of the resin-cored metal ball 209 is predetermined to begreater than the diameter of the through-hole 205. The volume of theresin-cored metal ball 209 is predetermined to be greater than thevolume of the opening of the through-hole 205.

The disposition of the resin-cored metal ball 209 can be accomplished bya known method involving the mounting of solder ball on a semiconductorpackage called BGA (Ball Grid Array). In some detail, at the positioncorresponding to the through-hole 205 is prepared a suction plate havinga suction hole having a smaller diameter than the diameter of the solderball formed therein which is connected to a vacuum pump for adjustingthe pressure in the suction hole. Subsequently, using the suction plate,the solder ball is sucked into the suction hole, positioned at the topof the through-hole 205, dropped and then positioned at the position ofthe through-hole 205. An equipment called ball mounter for performingthe aforementioned operation may be used. While the present embodimenthas been described with reference to the case where the solder ball ismounted by vacuum suction, electrostatic suction may be used.

Subsequently, as shown in FIG. 29, using the upper pressure plate 214and the lower pressure plate 215, the resin-cored metal ball 209 ispressed so that it is sequentially press-fitted into the through-hole205. Since the metal layer 208 on the surface of the resin-cored metalball 209 is made of a material containing a soft metal such as solderalloy, copper and copper alloy, the metal layer 208 is sequentiallydeformed while being press-fitted in the course of press-fitting by theresin-cored metal ball 209. Subsequently, the metal layer 208 isdeformed along the inner wall of the through-hole 205 while beingconnected to a part of the upper circuit layer 203 so that the interiorof the through-hole 205 is sequentially filled compactly with theresin-cored metal ball 209. Since as the resin ball 207 as core of theresin-cored metal ball 209 there is used one having a smaller diameterthan the diameter of the through-hole 205, the resin ball 207 cannot bedeformed. Thus, the deformation of the metal layer 208 on the surface ofthe resin-cored metal ball 209 causes the progress of press-fitting anddeformation of the resin-cored metal ball 209. In this manner, theresin-cored metal ball 209 can be press-fitted into the through-hole 205without giving any damage to the resin ball 207.

Subsequently, as shown in FIG. 30, the metal layer 208 under theresin-cored metal ball 209, i.e., metal layer 208 of the resin-coredmetal ball 209 on the lower pressure plate 215 side thereof comes incontact with the lower pressure plate 215 to undergo deformation so thatit is connected to the lower circuit layer 204. Thus, the press-fittingand deformation of the resin-cored metal ball 209 in the through-hole205 is finished. Since the resin-cored metal ball 209 has a greatervolume than the volume of the opening of the through-hole 205, theinterior of the through-hole 205 can be certainly filled with theresin-cored metal ball 209, making it assured that interlayer connectioncan be established between the upper circuit layer 203 and the lowercircuit layer 204. In this manner, a multi-layered FPC 2100 havinginterlayer connection as shown in FIG. 31, i.e., having the uppercircuit layer 203 and the lower circuit layer 204 electrically conductedto each other can be obtained by a very simple process.

While the present embodiment has been described with reference to thecase where the ball diameter of the resin-cored metal ball 209 isgreater than the diameter of the through-hole 205, the ball diameter ofthe resin-cored metal ball 209 may be the same as the diameter of thethrough-hole 205. In this case, too, the circuit layers can be connectedto each other by the deformation of the metal layer portion on both theupper and lower sides of the resin-cored metal ball 209. However, takinginto account the margin of deformation of the metal layer 208 and thecertainty of interlayer connection, the diameter of the resin-coredmetal ball 209 is preferably greater than the diameter of thethrough-hole 205.

The aforementioned method of producing a multi-layered FPC according tothe present embodiment has the following characteristics. Firstly, sincethe resin-cored metal ball 209 which is a conductor for makinginterlayer connection has a resin ball 207 provided therein, eventuallymaking it possible for the resin ball 207 to relax the stress developedby the difference in thermal expansion coefficient between the conductor206 and the insulating layer 202 that make interlayer connection. Inthis manner, the exfoliation of these layers at the connection interfaceattributed to the difference in thermal expansion coefficient can beprevented, making it possible to obtain a high reliability in electricalconnection between the upper circuit layer 203 and the lower circuitlayer 204.

Further, since the formation of the circuit layer is followed by theconnection between the upper circuit layer 203 and the lower circuitlayer 204, the process has no effects on the circuit layer. Accordingly,the reduction of the thickness of the copper foil 113 makes it possibleto exert an effect of finely patterning the circuit layer. Thus, thisprocess is suitable for the fineness of circuit layer. Further, sincethe interlayer connection between the upper circuit layer 203 and thelower circuit layer 204 can be made by a very simple process involvingthe press-fitting and deformation of the resin-cored metal ball 209, thenumber of required steps is less than other interlayer connectionmethods, providing excellent productivity and production cost.

Accordingly, in accordance with the method of producing a multi-layeredFPC according to the present embodiment, a multi-layered FPC having ahigh reliability of connection between circuit layers which is mostsuitable for fine patterning of circuit layer can be prepared at a goodproductivity.

While the method of producing a both-sided circuit board according toEmbodiment 4 has been described with reference to the case where thecopper foil 211 is formed directly on the both sides of the insulatinglayer 202, the following method of forming a both-sided circuit boardmay be used. In some detail, a copper foil 211 is formed directly on oneside of the insulating layer 202. The copper foil 211 is then etched toform a circuit layer thereon. Two sheets of such one-sided circuitboards are then prepared. Subsequently, the two sheets of one-sidedcircuit boards are laminated on each other with an adhesive layerinterposed therebetween with the circuit layer side thereof are disposedoutside. In this manner, a both-sided circuit board formed by laminatingtwo sheets of one-sided circuit boards as shown in FIG. 32 can beformed. In FIG. 32, the reference numeral 225 indicates a one-sidedcircuit board having an upper circuit layer 203 formed on one side ofthe insulating layer 202. The reference numeral 226 indicates anotherone-sided circuit board having a lower circuit layer 204 formed on oneside of the insulating layer 202. The reference numeral 228 indicates aboth-sided circuit board formed by laminating the one-sided circuitboard 225 and the other one-sided circuit board 226 on each other withan adhesive layer 227 with the circuit layer thereof disposed outside.The upper circuit layer 203 and the lower circuit layer 204 areconnected to each other via the conductor 206. A one-sided circuit boardallows finer patterning of circuit layer than a both-sided circuitboard. The both-sided circuit board obtained by laminating two sheets ofone-sided circuit boards has finer circuit layers. The fine patterningof circuit layers on the one-sided circuit board will be described indetail in the following Embodiment 5.

Embodiment 5

Embodiment 5 will be described in detail hereinafter with reference to amethod of producing a multi-layered FPC according to another embodimentof implementation of the invention excellent in reliability inconnection between circuit layers and fine pattering of circuit layersin connection with FIGS. 33 to 37. FIG. 34 is a sectional view of anessential part of a one-sided copper-clad laminated board with anadhesive layer which is a constituent element of a multi-layered FPCaccording to an embodiment of implementation of the invention. FIG. 35is a sectional view of an essential part of a one-sided circuit boardwith an adhesive layer having a circuit layer according to an embodimentof implementation of the invention formed thereon. FIG. 36 is asectional view of an essential part of a one-sided circuit board with anadhesive layer having a through-hole according to an embodiment ofimplementation of the invention formed therein. FIG. 37 is a sectionalview of an essential part shown at the beginning of press-fitting of aresin-cored metal ball into a multi-layered circuit layer having a blindvia hole according to en embodiment of implementation of the inventionformed therein.

In the aforementioned views, the reference numeral 2200 indicates amulti-layered FPC having the upper circuit layer 203 and the lowercircuit layer 204 electrically connected to each other via the conductor206. The reference numeral 216 indicates a one-sided copper-cladlaminated board with an adhesive layer having a copper foil 211 formedon one side of the insulating layer 202 and an adhesive layer 217 formedon the other side thereof. The reference numeral 218 indicates aone-sided circuit board with an adhesive layer having an upper circuitlayer 203 formed by etching the one-sided copper-clad laminated board216 with an adhesive layer. The reference numeral 220 indicates anotherone-sided circuit board having a lower circuit layer 204 to be laminatedon the one-sided circuit board 218 with an adhesive layer. The referencenumeral 221 indicates a multi-layered circuit layer formed by laminatingthe one-sided circuit board 218 with an adhesive layer and the otherone-sided circuit board 220 on each other in such an arrangement that ablind via hole 219 is formed for interlayer connection. A punching die213 is used to form a through-hole 205. An upper pressure plate 214 anda lower pressure plate 215 are used to press-fit and deform theresin-cored metal ball 209.

In the multi-layered FPC 2200 according to the present embodiment, aconductor 6 press-fitted in the interior of the blind via hole 219causes electrical interlayer connection between the upper circuit layer203 and the lower circuit layer 204 as shown in FIG. 33. The conductor206 is formed by pressing one resin-cored metal ball 209 having a resinball 207 having a smaller diameter than the diameter of the blind viahole 219 as a core portion and a surface metal coat layer 208 formed onthe surface thereof in the direction along the thickness of theinsulating layer 202 as described later so that the metal coat layer 208on the surface of the resin-cored metal ball 209 is deformed.

Thus, the conductor 206 that causes interlayer connection in themulti-layered FPC 2200 has the resin ball 207 provided in the corethereof as in Embodiment 4. In this arrangement, the Young's modulus ofthe conductor 206 can be lowered, making it possible for the resin ball207 to relax the stress developed by the difference in thermal expansioncoefficient. Further, the deformation of the metal layer 208 on thesurface of the resin-cored metal ball 209 makes it possible to disposethe resin-cored metal ball 209 (conductor 206) in the through-hole 205with the resin-cored metal ball 209 in contact with the upper circuitlayer 203 and the lower circuit layer 204 and in close contact with theblind via hole 219. As a result, the upper circuit layer 203 and thelower circuit layer 204 can be certainly electrically connected to eachother via the resin-cored metal ball 209 (conductor 206).

Thus, the greatest problem with the case where solid is used to makeinterlayer connection can be solved even with the multi-layered FPC 2200according to Embodiment 5. In other words, a problem can be solved thatwhen a conductor made of solder alone is heated, the solder in thethrough-hole expands beyond the insulating layer to cause the circuitlayer and the solder on the surface of the insulating layer to be peeledoff each other at the junction interface, making it impossible to assurethe desired connection reliability against heat. Accordingly, theconnection configuration of the multi-layered FPC 2200 according toEmbodiment 5, too, makes it possible to obtain a high reliability inelectrical connection between the upper circuit layer 203 and the lowercircuit layer 204.

In the present embodiment of implementation of the invention, theconductor 206 for interlayer connection is press-fitted in the blind viahole 219 having the lower circuit layer 204 at the bottom thereof. Inthis arrangement, as compared with the arrangement such that theconductor 206 for interlayer connection is press-fitted in thethrough-hole, the connection area between the conductor 206 and thecircuit layer can be raised. The bonding strength between the twolayers, too, can be raised. Accordingly, even when given variousexternal stresses in the multi-layered FPC 2200, the circuit layer andthe conductor 206 can be prevented from being peeled off each other atthe connection interface, making it possible to realize a multi-layeredFPC 2200 having a higher connection reliability.

When the metal layer 208 on the surface of the resin-cored metal ball209, in the same way as in Embodiment 4, is made of a soft metal,particularly at least one of soft metals such as solder alloy, copperand copper alloy, only the metal layer 208 on the surface of theresin-cored metal ball 209 can be deformed without giving any damage tothe resin ball 207, making it possible to obtain a higher reliability inelectrical connection between the upper circuit layer 203 and the lowercircuit layer 204.

A method of producing a multi-layered FPC 2200 according to Embodiment 5that realizes such a high connection reliability will be described indetail in connection with the attached drawings.

Firstly, as shown in FIG. 34, a one-sided copper-clad laminated board216 with an insulating layer having a copper foil 211 formed on one sideof an insulating layer 202 and an adhesive layer 217 formed on the otherside thereof is prepared. While the present embodiment has beendescribed with reference to the one-sided copper-clad laminated board216 free of adhesive layer between the insulating layer 202 and thecopper foil 211 by way of example, the invention is not limited thereto.A one-sided copper-clad laminated board with an insulating sheet havingan adhesive layer interposed between the insulating layer 202 and thecopper foil 211 or a one-sided copper-clad laminated board with aninsulating sheet having more layers may be used. The layer configurationmay be properly changed.

Subsequently, a mask material is formed on the surface of the copperfoil 211 according to a circuit pattern. The copper foil 211 is thenetched with an etching solution such as ferric chloride and copperchloride to obtain a one-sided circuit board 218 with an adhesive layerhaving an upper circuit layer 203 formed thereon as shown in FIG. 35. Inthe present embodiment, unlike the case where the circuit layer on theaforementioned both-sided circuit board is formed, one-sided etchingsuitable for fineness can be effected, making it possible to pattern theupper circuit layer 203 more finely. Accordingly, the upper circuitlayer 203 of the one-sided circuit board 218 with an adhesive layerobtained in the present embodiment can be patterned more finely than thecircuit layer of the aforementioned both-sided circuit board.

The reason for this mechanism will be described hereinafter. Since theformation of a circuit layer on both-sided circuit board normallyrequires that the copper foil on the both sides of a both-sidedcopper-clad laminated board be etched at the same time, it is necessarythat the etching solution be uniformly applied to the both-sidedcopper-clad laminated board on both the upper and lower sides thereof.However, when the etching solution is pressure-sprayed onto theboth-sided copper-clad laminated board on both the upper and lower sidesthereof, the etching solution sprayed onto the upper side of theboth-sided copper-clad laminated board then forms a liquid stagnant thatmakes it impossible to keep the desired etching uniformity. Thus, theconditions under which the both-sided circuit board is etched are unevenand unstable, making it difficult to form a very fine circuit layer.

On the other hand, the formation of a circuit layer on the one-sidedcircuit board requires that the etching solution be sprayed onto theone-sided copper-clad laminated board (copper foil is formed on thelower side of the one-sided circuit board) only on the lower sidethereof. Thus, the etching solution forms no liquid stagnant.Accordingly, the etching conditions can be predetermined to fall withinan optimum range. Therefore, the method of forming a circuit layer onthe one-sided circuit board according to the present embodiment issuitable for the fineness of circuit layer.

Subsequently, the one-sided circuit board 218 with an adhesive layerhaving an upper circuit layer 203 formed thereon is punched using apunching die 213 to form a through-hole 205 as shown in FIG. 36.Subsequently, as shown in FIG. 37, the one-sided circuit board 218 withan adhesive layer having a through-hole 205 formed therein and the otherone-sided circuit board 220 having a lower circuit layer 204 formedthereon are laminated on each other with the adhesive layer 217interposed therebetween with the lower circuit layer 204 and theadhesive layer 217 opposed to each other to obtain a multi-layeredcircuit board 221 having a blind via hole 219 formed therein forinterlayer connection.

The other one-sided circuit board 220 having a lower circuit layer 204formed thereon, too, can be sprayed with the etching solution on thelower side of the one-sided copper-clad laminated board (copper foil isformed on the lower side of the one-sided circuit board) to form a lowercircuit layer 204 similarly to the one-sided circuit board 218 with anadhesive layer having an upper circuit layer 203 formed thereon. Inother words, the lower circuit layer 204 is finely patterned similarlyto the upper circuit layer 203. Accordingly, the multi-layered circuitboard 221 thus obtained comprises one-sided circuit boards having finelypatterned circuit layers laminated on each other. Therefore, the circuitlayers on the multi-layered circuit board 221 are more finely patternedthan the circuit layers on the aforementioned both-sided circuit board.

Subsequently, as shown in FIG. 33, one resin-cored metal ball 209 isdisposed at the position of the opening of the blind via hole 219. Usingan upper pressure plate 214 and a lower pressure plate 215, theresin-cored metal ball 209 is then press-fitted into the blind via hole219. In this manner, the resin-cored metal ball 209 begins to bepress-fitted and deformed. When the entire resin-cored metal ball 209 ispress-fitted into the blind via hole 219, the resin-cored metal ball 209makes electrical interlayer connection between the upper circuit layer203 and the lower circuit layer 204 as a conductor 206 press-fitted inthe interior of the blind via hole 219 as shown in FIG. 33, making itpossible to obtain a multi-layered FPC 2200 excellent in fineness ofcircuit layers.

Referring to the resin-cored metal ball 209 to be press-fitted into theblind via hole 219, the diameter of the resin ball 207 as core of theresin-cored metal ball 209 is predetermined to be smaller than thediameter of the opening of the blind via hole 219. The metal layer 208on the surface of the resin-cored metal ball 209 is made of a soft metalsuch as solder alloy, copper and copper alloy as in Embodiment 4.Further, the ball diameter of the entire resin-cored metal ball 209 ispredetermined to be greater than the diameter of the opening of theblind via hole 219. The volume of the resin-cored metal ball 209 ispredetermined to be greater than the volume of the opening of the blindvia hole 219. The effect of this arrangement is the same as inEmbodiment 4.

In the present embodiment, the conductor 206 for interlayer connection(resin-cored metal ball 209) is press-fitted into the blind via hole 219having a lower circuit layer 204 at the bottom thereof. In thisarrangement, as compared with the arrangement such that the conductor206 for interlayer connection (resin-cored metal ball 209) ispress-fitted in the through-hole, the connection area of the conductor206 with the circuit layer can be raised. The bonding strength betweenthe two layers, too, can be raised. Accordingly, even when given variousexternal stresses, the circuit layer and the conductor 206 can beprevented from being peeled off each other at the connection interface,making it possible to obtain a higher connection reliability.

In accordance with the aforementioned method of producing amulti-layered FPC according to Embodiment 5, one-sided circuit boardsare laminated on each other, making it possible to pattern the circuitlayer more finely than in the case where a both-sided circuit board isused. Further, since the conductor 206 formed by press-fitting anddeforming the resin-cored metal ball 209 is press-fitted into the blindvia hole 219, a higher reliability in interlayer connection can beobtained than in the case where the conductor 6 formed by press-fittingand deforming the resin-cored metal ball 209 is press-fitted into thethrough-hole 205. Accordingly, in the present embodiment, too, amulti-layered FPC having a high reliability of connection betweencircuit layers which is most suitable for fineness of circuit layer canbe prepared at a good productivity.

Embodiment 6

Embodiment 6 will be described with reference to a multi-layered FPCaccording to the present embodiment of implementation of the inventionobtained by further laminating the aforementioned multi-layered FPC.FIG. 38 is a sectional view of an essential part of a multi-layered FPCwhich has been finished in lamination according to an embodiment ofimplementation of the invention. FIG. 39 is a sectional view of anessential part of another multi-layered FPC which has been finished inlamination according to an embodiment of implementation of theinvention.

In FIG. 38, the reference numeral 2300 indicates a multi-layered FPCobtained by laminating two multi-layered FPC 2100 a and 2100 b producedin Embodiment 4 above and multi-layered FPC 2200 a produced inEmbodiment 5 above with adhesive layers 223 and 224 interposedtherebetween. In the multi-layered FPC 2300, the multi-layered FPC 2100a and 2100 b and the multi-layered FPC 2200 a, which are constituentmembers of the multi-layered FPC 2300, have fine circuit layers with ahigh reliability in connection therebetween. Accordingly, even themulti-layered FPC 2300, which comprises more circuit layers than inEmbodiments 4 and 5, provides a high reliability in interlayerconnection as well as an excellent fineness of circuit layer.

In order to prepare the aforementioned multi-layered FPC 2300, twomulti-layered FPC 2100 a and 2100 b produced in Embodiment 4 arelaminated on and bonded to each other with an adhesive layer 223.Subsequently, the multi-layered FPC comprising the two multi-layered FPC2100 a and 2100 b laminated on each other and the multi-layered FPC 2200a produced in Embodiment 5 above are laminated on and bonded to eachother with an adhesive layer 224. In this manner, a multi-layered FPC2300 having more circuit layers can be obtained. The method of producingthe multi-layered FPC 2100 a and 2100 b and multi-layered FPC 2200 a arethe same as mentioned above and will not be described in detail. Thelamination of the multi-layered FPC 2100 a may be effected after thelamination of the multi-layered FPC 2100 b and the multi-layered FPC2200 a.

In FIG. 39, the reference numeral 2400 indicates a multi-layered FPCobtained by laminating the two multi-layered FPC 2100 c and 2100 dproduced in Embodiment 4 above and the multi-layered FPC 2200 b producedin Embodiment 5 above on each other with an adhesive layer 223 and anadhesive layer 224 interposed therebetween in such an arrangement thatthe conductor 206 thereof come in contact with each other. In themulti-layered FPC 2400, the multi-layered FPC 2100 c and 2100 d and themulti-layered FPC 200 b, which are constituent members of themulti-layered FPC 2400, have fine circuit layers with a high reliabilityin connection therebetween. Accordingly, even the multi-layered FPC2400, which comprises more circuit layers than in Embodiments 4 and 5,provides a high reliability in interlayer connection as well as anexcellent fineness of circuit layer. Further, the conductor 206 has asurface metal layer and thus allows connection between various adjacentcircuit layers in the multi-layered FPC 2100 c and 2100 d and themulti-layered FPC 2200 b.

In order to prepare the multi-layered FPC 2400, the two multi-layeredFPC 2100 c and 2100 d produced in Embodiment 4 above are laminated onand bonded to each other with an adhesive layer 223 interposedtherebetween in such an arrangement that the conductor 206 for themulti-layered FPC 2100 c and 2100 d come in contact with each other.Subsequently, the multi-layered FPC comprising the two multi-layered FPC2100 c and 2100 d laminated on each other and the multi-layered FPC 2200b produced in Embodiment 5 above are laminated on and bonded to eachother with an adhesive layer 224 interposed therebetween in such anarrangement that the conductor 206 (2100 d) for the multi-layered FPC2100 d and the conductor 206 (2200 b) for the multi-layered FPC 2200 bcome in contact with each other. In this arrangement, a multi-layeredFPC 2400 having more circuit layers can be obtained. Further, theconductor 206 has a surface metal layer and thus allows connectionbetween various adjacent circuit layers in the multi-layered FPC 2100 cand 2100 d and the multi-layered FPC 2200 b.

The method of producing the multi-layered FPC 2100 c and 2100 d andmulti-layered FPC 2200 b are the same as mentioned above and will not bedescribed in detail. The lamination of the multi-layered FPC 2100 c maybe effected after the lamination of the multi-layered FPC 2100 d and themulti-layered FPC 2200 b. In the case where resin-cored metal ballscomprising solider or solder alloy incorporated in the surface of theconductors 206 (2100 c), 206 (2100 d) and 206 (2200 b) are used in thepresent producing method, when these resin-cored metal balls are heatedand cooled with the conductors 206 (2100 c), 206 (2100 d) and 206 (2200b) in contact with each other, the solder or solder alloy on the surfaceof the conductors 206 (2100 c), 206 (2100 d) and 206 (2200 b) is fusedand solidified to cause the conductors 206 (2100 c), 206 (2100 d) and206 (2200 b) to be easily connected to each other, making it possible tofurther enhance the connection reliability.

The multi-layered FPC 2300 and 2400 according to the present embodimentthus obtained are formed by further laminating multi-layered FPC havingfine circuit layers connected to each other with a high reliability andthus provide a high reliability in interlayer connection and anexcellent fineness of circuit layers. Since the interlayer connection ofmulti-layered FPC, too, is carried out by the use of the aforementionedconductor, the interlayer connection material doesn't need to be newlyused, making it possible to obtain a higher productivity. Accordingly,the present embodiment, too, can provide a multi-layered FPC having ahigh reliability in interlayer connection which is most suitable forfineness of circuit layers at a high productivity.

Embodiment 7

A multi-layered FPC according to an embodiment of implementation of theinvention will be described hereinafter. Firstly, a multi-layered FPC ofthe invention will be described in connection with FIG. 40. FIG. 40 is asectional view of an essential part of a multi-layered FPC according toEmbodiment 7.

In FIG. 40, the reference numeral 3100 indicates a multi-layered FPCaccording to the present embodiment having an upper circuit layer 303and a lower circuit layer 304 formed on the both sides of an insulatinglayer 302 made of polyimide film. With a conductor 306 press-fitted inthe interior of the through-hole 305, continuity between the uppercircuit layer 303 and the lower circuit layer 304, that is, electricalinterlayer connection is established between the upper circuit layer 303and the lower circuit layer 304. The conductor 306 is formed by alaminate of a metal plug 308 formed by press-fitting one substantiallyspherical conductor 307 and a solder connector 309 made of solder alloyas shown in FIG. 40. As the solder formulation of the solder connector309 there may be used any of eutectic solder, high temperature solderand lead-free solder depending on the various conditions without anylimitation.

Thus, the conductor 306 that makes interlayer connection in themulti-layered FPC 3100 is formed by a laminate of the metal plug 308formed by press-fitting the substantially spherical conductor 307 andthe solder connector 309 made of solder material. In this arrangement,the metal plug 308 having a drastically smaller thermal expansioncoefficient than that of solder material and the solder connector 309can be combined to lower the thermal expansion coefficient of the entireconductor 306 to that of the insulating layer 302.

In this arrangement, the greatest problem with interlayer connectionwith solder can be solved. In other words, a problem can be solved thatwhen a conductor made of solder alone is heated, the solder in thethrough-hole expands beyond the insulating layer to cause the circuitlayer and the solder on the surface of the insulating layer to be peeledoff each other at the junction interface, making it impossible to assurethe desired connection reliability against heat. Accordingly, theconnection configuration of the multi-layered FPC 3100 according to thepresent embodiment makes it possible to obtain a high reliability inelectrical connection between the upper circuit layer 303 and the lowercircuit layer 304.

As the substantially spherical conductor 307 there may be used a spheremetal particle excellent in uniformity in particle diameter andsphericity obtained by uniform metal droplet spraying method, thoughpoor in productivity, or a substantially spherical metal particleobtained by atomizing method, which is poor in uniformity in particlediameter and sphericity but suitable for mass production. Taking intoaccount the difference in productivity, the former method provides anexpensive member while the latter method provides in inexpensive member.In the invention, even when the particle diameter of substantiallyspherical conductors 307 is uneven, the solder connector 309 can bedisposed interposed between the substantially spherical conductors 307to absorb the dispersion of particle diameter of the substantiallyspherical conductors 307, making it possible to obtain desiredinterlayer connection. Accordingly, as the substantially sphericalconductor 307 to be used in the invention there may be used asubstantially spherical metal particle obtained by the atomizing method,which is poor in uniformity in particle diameter and sphericity butinexpensive. In this arrangement, a multi-layered FPC having a highreliability in connection between circuit layers can be realized atreduced cost. Further, the substantially spherical conductor to be usedas a material constituting the metal plug can be easily handled.Moreover, the substantially spherical conductor can be easily producedto advantage.

As the material of the substantially spherical conductor 307 there maybe used a metal. Further, the material of the substantially sphericalconductor 307 preferably contains at least one of soft metals. Theconstitution of the substantially spherical conductor 307 by a softmetal makes it possible to smoothly press-fit the substantiallyspherical conductor 307 into the through-hole 305 without breaking thethrough-hole 305. Thus, a metal plug 308 kept fully in contact with thewall surface of the through-hole 305 can be formed. Since the metal plug308 is embedded in the through-hole 305 with a high adhesivity, a higherconnection reliability can be obtained. The term “soft metal” as usedherein is meant to indicate a metal that can be used for circuit purposeamong metals having a good conductivity that conform with the substrateor insulating layer 302 in thermal expansion coefficient and are soductile as to undergo plastic deformation. Specific examples of thematerial of the substantially spherical conductor 307 include copper,aluminum, nickel, gold, silver, palladium, and alloy thereof. Preferredamong these materials are copper and copper alloy. This is becausecopper and copper alloy conform most fairly with the substrate(insulating layer) in thermal expansion coefficient.

The opening shape of the through-hole 305 in which the conductor 306having such a laminated structure is press-fitted is not specificallylimited but is preferably circle.

A method of producing the multi-layered FPC 100 according to the presentembodiment that can realize a high reliability in electrical connectionbetween the upper circuit layer 303 and the lower circuit layer 304 byusing the conductor 306 having such a laminated structure will bedescribed in detail in connection with FIGS. 41 to 48. In the followingviews, where the constituent elements are the same as those in FIG. 40,the same reference numerals as in FIG. 40 are used. Detailed descriptionof these constituent elements will not be made.

FIGS. 41 to 48 each are a diagram illustrating a procedure of producingthe multi-layered FPC 100 according to Embodiment 7. FIG. 41 is asectional view of an essential part of a both-sided copper-cladlaminated board which is a constituent element of a multi-layered FPCaccording to an embodiment of implementation of the invention. FIG. 42is a sectional view of an essential part of a both-sided circuit boardhaving a circuit layer according to an embodiment of implementation ofthe invention formed thereon. FIG. 43 is a sectional view of anessential part of a both-sided circuit board having a through-holeaccording to an embodiment of implementation of the invention formedtherein. FIG. 44 is a sectional view of an essential part of aboth-sided circuit board having a substantially spherical conductoraccording to an embodiment of implementation of the invention disposedthereon. FIG. 45 is a sectional view of an essential part of aboth-sided circuit board having a substantially spherical conductoraccording to an embodiment of implementation of the inventionpress-fitted therein. FIG. 46 is a sectional view of an essential partof a both-sided circuit board having a solder ball according to anembodiment of implementation of the invention disposed thereon. FIG. 47is a sectional view of an essential part of a both-sided circuit boardhaving a solder ball according to an embodiment of implementation of theinvention press-fitted therein. FIG. 48 is a sectional view of anessential part of a multi-layered FPC shown after interlayer connectionaccording to an embodiment of implementation of the invention. FIG. 49is a sectional view of an essential part of a multi-layered FPCaccording to an embodiment of implementation of the invention.

In the aforementioned views, the reference numeral 310 indicates aboth-sided copper-clad laminated board having a copper foil 311 formedon the both sides of an insulating layer 302. The reference numeral 312indicates a both-sided circuit board having an upper circuit layer 303and a lower circuit layer 304 formed thereon obtained by etching theboth-sided copper-clad laminated board 310. The reference numeral 313indicates a punching die for forming through-hole. The reference numeral314 indicates a suction board for disposing the substantially sphericalconductor 307. The reference numeral 315 indicates a pressing top platewhich moves vertically for press-fitting. The reference numeral 316indicates a pressing bottom plate. The reference numeral 317 indicates asolder ball which is press-fitted to become a solder connector 309.

The method of producing the multi-layered FPC 3100 will be described inconnection with the attached drawings. Firstly, as shown in FIG. 41, aboth-sided copper-clad laminated board 310 having a copper foil 311formed on both sides of an insulating layer 302 is prepared. While thepresent embodiment is described with reference to the two-layer typeboth-sided copper-clad laminated board 310 free of adhesive layerbetween the insulating layer 302 and the copper foil 311 by way ofexample, the invention is not limited thereto. A three-layer typeboth-sided copper-clad laminated board having an adhesive layerinterposed between the insulating layer 302 and the copper foil 311 or aboth-sided copper-clad laminated board having more layers may be used.The layer configuration may be properly changed.

Subsequently, a mask material is formed on the surface of the copperfoil 311 according to a circuit pattern. The copper foil 311 is thenetched with a copper etching solution such as ferric chloride and copperchloride to obtain a both-sided circuit board 312 having an uppercircuit layer 303 and a lower circuit layer 304 formed on the respectiveside of the insulating layer 302 as shown in FIG. 42 (The upper circuitlayer 303 and the lower circuit layer 304 will be hereinafteroccasionally referred generically to as “circuit layer”). The uppercircuit layer thus obtained cannot be affected at the subsequent steps.Accordingly, in accordance with the method of producing a multi-layeredFPC according to the present embodiment, the reduction of the thicknessof the copper foil 311 makes it possible to exert an effect of finecircuit layer.

Subsequently, the both-sided circuit board 312 having a circuit layerformed thereon is punched using the punching die 313 to form athrough-hole 305 therein as shown in FIG. 43. Subsequently, as shown inFIG. 44, using the suction board 314, air is sucked on the through-hole305 side so that one substantially spherical conductor 307 is disposedon one of the openings of the through-hole 305 (on the upper circuitlayer 303 side). Subsequently, as shown in FIG. 45, the both-sidedcircuit board 312 is put on the pressing bottom plate 316. The pressingtop plate 315 is then moved downward to press-fit the substantiallyspherical conductor 307 into the through-hole 305 so that a metal plug308 is formed in the through-hole 305.

Subsequently, as shown in FIG. 46, the both-sided circuit board 312having the metal plug 308 formed thereon is turned over. A solder ball317 is then put on the other through-hole 305, i.e., on the sideopposite the metal plug 308 (on the lower circuit layer 304 side). Thedisposition of a solder ball 317 here can be accomplished by a knownmethod involving the mounting of solder ball 317 on a semiconductorpackage called BGA (Ball Grid Array). In some detail, at the positioncorresponding to the through-hole 305 is prepared a suction plate havinga suction hole having a smaller diameter than the diameter of the solderball 317 formed therein which is connected to a vacuum pump foradjusting the pressure in the suction hole. Subsequently, using thesuction plate, the solder ball 317 is sucked into the suction hole,positioned at the top of the other opening of the through-hole 305,dropped and then positioned at the top of the other opening of thethrough-hole 305. An equipment called ball mounter for performing theaforementioned operation may be used. While the present embodiment hasbeen described with reference to the case where the solder ball 317 ismounted by vacuum suction, electrostatic suction may be used. A suitablemethod may be properly selected.

Subsequently, the both-sided circuit board 312 having the solder ball317 disposed thereon is put on the pressing bottom plate 316 as shown inFIG. 47. The pressing top plate 315 is then moved downward to press-fitthe solder ball 317 into the through-hole 305 so that a solder connector309 connected to the metal plug 308 is formed. In this manner, aconductor 306 having the metal plug 308 and the solder connector 309laminated on each other can be formed, making it possible to establishinterlayer connection between the upper circuit layer 303 and the lowercircuit layer 304. Thereafter, the laminate is removed from the press asshown in FIG. 48. As a result, a multi-layered FPC 3100 having the uppercircuit layer 303 and the lower circuit layer 304 connected to eachother with the conductor 306 formed by laminating the metal plug 308 andthe solder connector 309 on each other can be obtained by a very simpleprocess.

The aforementioned method of producing a multi-layered FPC according tothe present embodiment has the following characteristics. Since theconductor 306 having the metal plug 308 and the solder connector 309laminated on each other is formed as conductor for interlayerconnection, a multi-layered FPC having a high connection reliability canbe prepared. In other words, since the metal plug 308 having adrastically smaller thermal expansion coefficient than that of thesolder material and the solder connector 309 are combined to form theconductor 306, the thermal expansion coefficient of the entire conductor306 can be lowered to that of the insulating layer 302. In this manner,the exfoliation of the circuit layer and the solder on the surface ofthe insulating layer 302 off each other at the connection interfaceattributed to the thermal expansion of solder in the case where solderis used to make interlayer connection can be prevented. Accordingly, ahigh reliability in interlayer connection between the upper circuitlayer 303 and the lower circuit layer 304 can be established.

Further, since the formation of the circuit layer is followed by theinterlayer connection between the upper circuit layer 303 and the lowercircuit layer 304, the process has no effects on the circuit layer.Accordingly, the reduction of the thickness of the copper foil 311 makesit possible to exert an effect of fine circuit layer. Further, since theinterlayer connection between the upper circuit layer 303 and the lowercircuit layer 304 can be made by a very simple process involving thepress-fitting of the substantially spherical conductor 307 and thesolder ball 317, the number of required steps is less than otherinterlayer connection methods, providing excellent productivity andproduction cost.

Accordingly, in accordance with the method of producing a multi-layeredFPC according to the present embodiment, a multi-layered FPC having ahigh reliability of connection between circuit layers which is mostsuitable for fineness of circuit layer can be prepared at a goodproductivity.

While the aforementioned description has been made with reference to thecase where the formation of the solder connector 309 is accomplished bythe press-fitting of the solder ball 317, a particulate solder materialmay be packed and fused in the through-hole 305 to form a solderconnector which is then connected to the metal plug. In accordance withthis producing method, the particulate solder material is fused andsolidified once. Thus, a rigid alloy layer can be formed at theinterface of the solder connector with the metal plug, making itpossible to obtain a multi-layered FPC having a higher connectionreliability. The method of forming the solder connector 309 can beproperly selected depending on the conditions and should not bespecifically limited.

While the method of producing a both-sided circuit board according toEmbodiment 7 has been described with reference to the case where thecopper foil 311 is formed directly on the both sides of the insulatinglayer 302, the following method of forming a both-sided circuit boardmay be used. In some detail, a copper foil 311 is formed directly on oneside of the insulating layer 302. The copper foil 311 is then etched toform a circuit layer thereon. Two sheets of such one-sided circuitboards are then prepared. Subsequently, the two sheets of one-sidedcircuit boards are laminated on each other with an adhesive layerinterposed therebetween with the circuit layer side thereof are disposedoutside. In this manner, a both-sided circuit board formed by laminatingtwo sheets of one-sided circuit boards as shown in FIG. 49 can beformed. In FIG. 49, the reference numeral 326 indicates a one-sidedcircuit board having an upper circuit layer 303 formed on one side ofthe insulating layer 302. The reference numeral 327 indicates anotherone-sided circuit board having a lower circuit layer 304 formed on oneside of the insulating layer 302. The reference numeral 329 indicates aboth-sided circuit board formed by laminating the one-sided circuitboard 326 and the other one-sided circuit board 327 on each other withan adhesive layer 328 with the circuit layer thereof disposed outside.The upper circuit layer 303 and the lower circuit layer 304 areconnected to each other via the conductor 306. A one-sided circuit boardallows finer circuit layer than a both-sided circuit board. Theboth-sided circuit board obtained by laminating two sheets of one-sidedcircuit boards has finer circuit layers. The fine circuit layers on theone-sided circuit board will be described in detail in the followingEmbodiment 8.

In this producing method, a substantially spherical conductor 307 havinga surface coat layer of solder material formed thereon may be used. Inthis case, the metal plug 308 is formed in the through-hole 305.Subsequently, the solder ball 317 is press-fitted into the through-hole305 to form the solder connector 309. When the solder connector 309 isthen heated and cooled, the solder material on the surface of the metalplug 308 and the solder connector 309 are fused and solidified, allowingfirmer connection between the metal plug 308 and the solder connector309 and making it possible to further enhance the reliability ininterlayer connection.

Embodiment 8

Embodiment 8 will be described in detail hereinafter with reference to amethod of producing a multi-layered FPC according to another embodimentof implementation of the invention excellent in reliability inconnection between circuit layers and fine circuit layers in connectionwith FIGS. 50 to 54. FIG. 50 is a sectional view of an essential part ofa multi-layered FPC shown after interlayer connection according to anembodiment of implementation of the invention. FIG. 51 is a sectionalview of an essential part of a one-sided copper-clad laminated boardwith an adhesive layer which is a constituent element of a multi-layeredFPC according to an embodiment of implementation of the invention. FIG.52 is a sectional view of an essential part of a one-sided circuit boardwith an adhesive layer having a circuit layer according to an embodimentof implementation of the invention formed thereon. FIG. 53 is asectional view of an essential part of a one-sided circuit board with anadhesive layer having a through-hole according to an embodiment ofimplementation of the invention formed therein. FIG. 54 is a sectionalview of an essential part of a laminated circuit board having a blindvia hole according to an embodiment of implementation of the inventionformed therein.

In the aforementioned views, the reference numeral 3200 indicates amulti-layered FPC having the upper circuit layer 303 and the lowercircuit layer 304 electrically connected to each other via the conductor306. The reference numeral 318 indicates a one-sided copper-cladlaminated board with an adhesive layer having a copper foil 311 formedon one side of the insulating layer 302 and an adhesive layer 319 formedon the other side thereof. The reference numeral 320 indicates aone-sided circuit board with an adhesive layer having an upper circuitlayer 303 formed by etching the one-sided copper-clad laminated board318 with an adhesive layer. The reference numeral 321 indicates anotherone-sided circuit board having a lower circuit layer 304 to be laminatedon the one-sided circuit board 320 with an adhesive layer. The referencenumeral 322 indicates a laminated circuit board formed by laminating theone-sided circuit board 320 with an adhesive layer and the otherone-sided circuit board 321 on each other in such an arrangement that ablind via hole 323 is formed for interlayer connection. A punching die313 is used to form a through-hole 305.

In the multi-layered FPC 3200 according to the present embodiment, aconductor 306 press-fitted in the interior of the blind via hole 323causes electrical interlayer connection between the upper circuit layer303 and the lower circuit layer 304 as shown in FIG. 50. The conductor306 is formed by a laminate of a metal plug 308 having a drasticallysmaller thermal expansion coefficient than that of the solder materialformed by press-fitting one substantially spherical conductor 307 and asolder connector 309 made of solder material as in Embodiment 7. In thisarrangement, the thermal expansion coefficient of the entire conductor306 can be lowered to that of the insulating layer 302. In this manner,the exfoliation of the circuit layer and the solder on the surface ofthe insulating layer 302 off each other at the connection interfaceattributed to the thermal expansion of solder in the case where solderis used to make interlayer connection can be prevented. Accordingly, inthe multi-layered FPC 3200 according to the present embodiment ofimplementation of the invention, too, the upper circuit layer 303 andthe lower circuit layer 304 can be certainly electrically connected toeach other via the conductor 306, making it possible to obtain a highreliability in interlayer connection between the upper circuit layer 303and the lower circuit layer 304.

In the present embodiment of implementation of the invention, theconductor 306 for interlayer connection is press-fitted in the blind viahole 323 having a lower circuit layer 304 at the bottom thereof. In thisarrangement, as compared with the arrangement such that the conductor306 for interlayer connection is press-fitted in the through-hole, theconnection area between the conductor 306 and the circuit layer can beraised. The bonding strength between the two layers, too, can be raised.Accordingly, in the multi-layered FPC 3200, even when given variousexternal stresses, the circuit layer and the conductor 306 can beprevented from being peeled off each other at the connection interface,making it possible to realize a multi-layered FPC 3200 having a higherconnection reliability.

Further, the use a soft metal, particularly at least one of copper andcopper alloy, as the metal plug 308 (substantially spherical conductor307), in the same way as in Embodiment 7, makes it possible to obtain ahigher reliability in interlayer connection between the upper circuitlayer 303 and the lower circuit layer 304. This is because copper andcopper alloy match most fairly with the substrate (insulating layer) inthermal expansion coefficient.

A method of the multi-layered FPC 200 according to Embodiment 8 that canrealize such a high connection reliability will be described in detailin connection with the attached drawings.

Firstly, a one-sided copper-clad laminated board 318 with an adhesivesheet having a copper foil 311 formed directly on one side of aninsulating layer 302 and an adhesive layer 319 formed on the other sidethereof as shown in FIG. 51 is prepared. While the present embodimenthas been described with reference to the one-sided copper-clad laminatedboard 318 free of adhesive layer between the insulating layer 302 andthe copper foil 311 by way of example, the invention is not limitedthereto. A one-sided copper-clad laminated board having an adhesivelayer interposed between the insulating layer 302 and the copper foil311 or a one-sided copper-clad laminated board having more layers may beused. The layer configuration may be properly changed.

Subsequently, a mask material is formed on the surface of the copperfoil 311 according to a circuit pattern. The copper foil 311 is thenetched with an etching solution such as ferric chloride and copperchloride to obtain a one-sided circuit board 320 with an adhesive layerhaving an upper circuit layer 303 formed thereon as shown in FIG. 52. Inthe present embodiment, unlike the case where the circuit layer on theaforementioned both-sided circuit board is formed, one-sided etchingsuitable for fineness can be effected, making it possible to pattern theupper circuit layer 303 more finely. Accordingly, the upper circuitlayer 303 of the one-sided circuit board 320 with an adhesive layerobtained in the present embodiment can be patterned more finely than thecircuit layer of the aforementioned both-sided circuit board.

The reason for this mechanism will be described hereinafter. Since theformation of a circuit layer on both-sided circuit board normallyrequires that the copper foil on the both sides of a both-sidedcopper-clad laminated board be etched at the same time, it is necessarythat the etching solution be uniformly applied to the both-sidedcopper-clad laminated board on both the upper and lower sides thereof.However, when the etching solution is pressure-sprayed onto theboth-sided copper-clad laminated board on both the upper and lower sidesthereof, the etching solution sprayed onto the upper side of theboth-sided copper-clad laminated board then forms a liquid stagnant thatmakes it impossible to keep the desired etching uniformity. Thus, theconditions under which the both-sided circuit board is etched are unevenand unstable, making it difficult possible to form a very fine circuitlayer.

On the other hand, the formation of a circuit layer on the one-sidedcircuit board requires that the etching solution be sprayed onto theone-sided copper-clad laminated board (copper foil is formed on thelower side of the one-sided circuit board) only on the lower sidethereof. Thus, the etching solution forms no liquid stagnant.Accordingly, the etching conditions can be predetermined to fall withinan optimum range. Therefore, the method of forming a circuit layer onthe one-sided circuit board according to the present embodiment issuitable for the fine circuit layer.

Subsequently, the one-sided circuit board 320 with an adhesive layerhaving an upper circuit layer 303 formed thereon is punched using apunching die 313 to form a through-hole 305 as shown in FIG. 53.Subsequently, as shown in FIG. 54, the one-sided circuit board 320 withan adhesive layer having a through-hole 305 formed therein and the otherone-sided circuit board 321 having a lower circuit layer 304 formedthereon are laminated on each other with the adhesive layer 319interposed therebetween with the lower circuit layer 304 and theadhesive layer 319 opposed to each other to obtain a laminated circuitboard 322 having a blind via hole 323 formed therein for interlayerconnection.

The other one-sided circuit board 321 having a lower circuit layer 304formed thereon, too, can be sprayed with the etching solution on thelower side of the one-sided copper-clad laminated board (copper foil isformed on the lower side of the one-sided circuit board) to form a lowercircuit layer 304 similarly to the one-sided circuit board 320 with anadhesive layer having an upper circuit layer 303 formed thereon. Inother words, the lower circuit layer 304 is finely patterned similarlyto the upper circuit layer 303. Accordingly, the multi-layered circuitboard 322 thus obtained comprises one-sided circuit boards having finecircuit layers laminated on each other. Therefore, the circuit layers onthe multi-layered circuit board are more finely patterned than thecircuit layers on the aforementioned both-sided circuit board.

Finally, the interior of the blind via hole 323 is previously filledwith a solder ball made of solder material or a particulate solder. Onesubstantially spherical conductor is then pressed onto the solder ballor particulate solder in the blind via hole 323 to form a conductor 306formed by a laminate of a solder connector 309 formed by a solder ballor particulate solder and a metal plug 308 formed by a substantiallyspherical conductor. In this manner, a multi-layered FPC 3200 excellentin fineness of circuit layers having the upper circuit layer 303 and thelower circuit layer 304 electrically conducted to each other with theconductor 306 can be obtained as shown in FIG. 50.

In the method of producing a multi-layered FPC according to the presentembodiment, the conductor 306 for interlayer connection is press-fittedinto the blind via hole 323 having a lower circuit layer 304 at thebottom thereof. In this arrangement, as compared with the arrangementsuch that the conductor 306 for interlayer connection is press-fitted inthe through-hole, the connection area of the conductor 306 with thecircuit layer can be raised. The bonding strength between the twolayers, too, can be raised. Accordingly, even when given variousexternal stresses, the circuit layer and the conductor 306 can beprevented from being peeled off each other at the connection interface,making it possible to obtain a higher connection reliability.

In accordance with the aforementioned method of producing amulti-layered FPC according to the present embodiment of implementationof the invention, one-sided circuit boards are laminated on each other,making it possible to pattern the circuit layer more finely than in thecase where a both-sided circuit board is used. Further, since theconductor 306 formed by press-fitting a solder ball and a substantiallyspherical conductor is press-fitted into the blind via hole 323, ahigher reliability in connection between circuit layers can be obtainedthan in the case where the conductor 306 formed by press-fitting asolder ball and a substantially spherical conductor is press-fitted intothe through-hole 305. Accordingly, in the present embodiment, too, amulti-layered FPC having a high reliability of connection betweencircuit layers which is most suitable for fineness of circuit layer canbe prepared at a good productivity.

In this producing method, a substantially spherical conductor coatedwith a solder material on the surface thereof can be used. In this case,the formation of a conductor 306 formed by a laminate of a solderconnector 309 formed by a solder ball or particulate solder and a metalplug 308 formed by the substantially spherical conductor is followed byheating and cooling as mentioned above. In this manner, the soldermaterial on the surface of the metal plug 308 and the solder connector309 are fused and solidified, allowing firmer bonding between the metalplug 308 and the solder connector 309 and making it possible to furtherenhance the reliability in interlayer connection.

Embodiment 9

Embodiment 9 will be described hereinafter with reference to amulti-layered FPC according to the invention obtained by furtherlaminating the aforementioned multi-layered FPC. FIG. 55 is a sectionalview of an essential part of a multi-layered FPC which has been finishedin lamination according to an embodiment of implementation of theinvention. FIG. 56 is a sectional view of an essential part of anothermulti-layered FPC which has been finished in lamination according to anembodiment of implementation of the invention.

In FIG. 55, the reference numeral 3300 indicates a multi-layered FPCobtained by laminating the multi-layered FPC 3100 a and 3100 b producedin Embodiment 7 above and the multi-layered FPC 3200 a produced inEmbodiment 8 above on each other with adhesive layers 324 and 325interposed therebetween, respectively. In the multi-layered FPC 3300,the multi-layered FPC 3100 a and 3100 b and the multi-layered FPC 3200a, which are constituent members of the multi-layered FPC 3300, havefine circuit layers with a high reliability in connection therebetween.Accordingly, even the multi-layered FPC 3300, which comprises morecircuit layers than in Embodiments 7 and 8, provides the multi-layeredFPC having a high reliability in interlayer connection as well as anexcellent fineness in circuit layer.

In order to prepare the aforementioned multi-layered FPC 3300, the twomulti-layered FPC 3100 a and 3100 b produced in Embodiment 7 above arelaminated on and bonded to each other with an adhesive layer 324interposed therebetween. Subsequently, when the laminate is heated andcooled with the conductor 306 on the two multi-layered FPC in contactwith each other, the solder connector 309 on the surface of theconductor 306 is then fused and solidified to cause the conductor 306and the circuit layer to be easily connected to each other.

Subsequently, the multi-layered FPC having two multi-layered FPC 3100 aand 3100 b laminated on each other and the multi-layered FPC 3200 aproduced in Embodiment 8 above are laminated on and bonded to each otherwith an adhesive layer 325 interposed therebetween. Subsequently, whenthe laminate is heated and cooled with the conductors 306 in contactwith each other, the solder connector 309 on the surface of theconductor 306 is fused and solidified to cause the conductor 306 and thecircuit layer to be easily connected to each other. In this manner, amulti-layered FPC 3300 having more circuit layers can be obtained. Themethod of producing a multi-layered FPC 3100 a and 3100 b and themulti-layered FPC 3200 a are the same as mentioned above and thus willnot be described in detail. Further, the lamination of the multi-layeredFPC 3100 a may be effected after the lamination of the multi-layered FPC3100 b and the multi-layered FPC 3200 a on each other.

In FIG. 56, the reference numeral 3400 indicates a multi-layered FPCobtained by laminating the two multi-layered FPC 3100 c and 3100 dproduced in Embodiment 7 above and the multi-layered FPC 3200 b producedin Embodiment 8 above on each other with adhesive layers 324 and 325interposed therebetween, respectively, in such an arrangement that theconductor 306 on the these multi-layered FPC come in contact with eachother. In the multi-layered FPC 3400, the multi-layered FPC 3100 c and3100 d and the multi-layered FPC 3200 b, which are constituent membersof the multi-layered FPC 3400, have fine circuit layers with a highreliability in connection therebetween. Accordingly, even themulti-layered FPC 3400, which comprises more circuit layers than inEmbodiments 7 and 8, provides the multi-layered FPC having a highreliability in interlayer connection as well as an excellent fineness incircuit layer. Further, since the surface of the conductor 306 is themetal plug 308 or solder connector 309, the various adjacent circuitlayers can be electrically connected to each other in the multi-layeredFPC 3100 c and 3100 d and the multi-layered FPC 3200 b.

In order to prepare the aforementioned multi-layered FPC 3400, the twomulti-layered FPC 3100 c and 3100 d produced in Embodiment 7 arelaminated on and bonded to each other with an adhesive layer 324 withthe conductors 306 (for 3100 c) and 306 (for 3100 d) in contact witheach other. When the laminate is then heated and cooled with theconductors 306 in contact with each other, the solder connector 309 onthe surface of the conductor 306 is fused and solidified to cause theconductors 306 to be easily connected to each other.

Subsequently, the multi-layered FPC comprising the two multi-layered FPC3100 c and 3100 d laminated on each other and the multi-layered FPC 3200b produced in Embodiment 8 above are laminated on and bonded to eachother with an adhesive layer 325 in such an arrangement that theconductor 306 (3100 d) for the multi-layered FPC 3100 d and theconductor 306 (3200 b) for the multi-layered FPC 3200 b come in contactwith each other. Subsequently, when the laminate is heated and cooledwith the conductors 306 in contact with each other, the solder connector309 on the surface of the conductor 306 is fused and solidified to causethe conductors 306 to be easily connected to each other. In this manner,a multi-layered FPC 3400 having more circuit layers can be obtained.Further, since the surface of the conductor 306 is the metal plug 308 orsolder connector 309, the various adjacent circuit layers can beelectrically connected to each other in the multi-layered FPC 3100 c and3100 d and the multi-layered FPC 3200 b.

The method of producing the multi-layered FPC 3100 c and 3100 d andmulti-layered FPC 3200 b are the same as mentioned above and will not bedescribed in detail. The lamination of the multi-layered FPC 3100 c maybe effected after the lamination of the multi-layered FPC 3100 d and themulti-layered FPC 3200 b.

The multi-layered FPC 300 and 400 according to the present embodimentthus obtained are formed by further laminating multi-layered FPC havingfine circuit layers connected to each other with a high reliability andthus provide a high reliability in interlayer connection and anexcellent fineness in circuit layers. Since the interlayer connection ofmulti-layered FPC, too, is carried out by the use of the aforementionedconductor, the interlayer connection material doesn't need to be newlyused, making it possible to obtain a higher productivity. Accordingly,the present embodiment, too, can provide a multi-layered FPC having ahigh reliability in interlayer connection which is most suitable forfineness of circuit layers at a high productivity.

Embodiment 10

FIG. 57 is a side sectional view of an essential part of a flexibleprint circuit board according to Embodiment 10.

In FIG. 57, the reference numeral 4001 indicates a flexible printcircuit board according to Embodiment 10. The reference numeral 402indicates an insulating layer made of polyimide film. The referencenumeral 403 indicates an upper electrically-conductive layer having apredetermined conductor pattern formed thereon by etching a copper foilstuck to the upper side of the insulating layer 402. The referencenumeral 404 indicates a lower electrically-conductive layer having apredetermined conductor pattern formed thereon by etching a copper foilstuck to the lower side of the insulating layer 402. The referencenumeral 405 indicates an interlayer connection portion electricallyconnecting between the upper electrically-conductive layer 403 and thelower electrically-conductive layer 404. The reference numeral 406indicates a cone-shaped conductor press-fit hole for the interlayerconnection portion 405 formed in the upper electrically-conductive layer403, the insulating layer 402 and the lower electrically-conductivelayer 404 and opened wider towards the upper electrically-conductivelayer 403. The reference numeral 407 indicates a conductor at theinterlayer connection portion 405 which is adapted to be press-fittedinto the conductor press-fit hole 406 to electrically connect betweenthe upper side of the upper electrically-conductive layer 403 and thesurface of the upper electrically-conductive layer 403 on the conductorpress-fit hole 406 side thereof and the surface of the lowerelectrically-conductive layer 404 on the conductor press-fit hole 406side thereof

A method of producing the flexible print circuit board 4001 according toEmbodiment 10 having the aforementioned constitution will be describedhereinafter in connection with the attached drawings.

FIG. 58A is a sectional view of an essential part of a both-sidedcopper-clad laminated board to be used in the production of a flexibleprint circuit board according to Embodiment 1. FIG. 58B is a sidesectional view of an essential part illustrating a both-sided circuitboard. FIG. 58C is a side sectional view illustrating a conductorpress-fit hole forming step. FIG. 58D is a side sectional view of anessential part illustrating a conductor press-fitting step. FIG. 58E isa side sectional view of an essential part illustrating how theconductor is press-fitted into the conductor press-fit hole.

In FIG. 58, the reference numeral 408 indicates a both-sided copper-cladlaminated board. The reference numeral 409 indicates a copper stuck tothe both sides of the insulating layer 402. The reference numeral 410indicates a both-sided circuit board having an upperelectrically-conductive layer 403 and a lower electrically-conductivelayer 404 formed by etching the copper foil 409 such that apredetermined conductor pattern is formed. The reference numeral 411indicates a pressing portion for press-fitting the conductor 407 intothe conductor press-fit hole 406 of the both-sided circuit board 410.

Firstly, as shown in FIG. 58A, a both-sided copper-clad laminated board408 having a copper foil 409 stuck to the both sides of an insulatinglayer 402 is prepared. As the copper foil 409 there may be usedelectrolytic copper foil or rolled copper foil. While Embodiment 10 hasbeen described with reference to the case where the both-sidedcopper-clad laminated board 408 having the copper foil 409 stuck to theinsulating layer 402 without any adhesive is used, the invention is notlimited thereto. The copper foil 409 may be bonded to the insulatinglayer 402 with an adhesive made of a synthetic resin such as epoxy-basedand acrylic resins.

Subsequently, as shown in FIG. 58B, an etching resist (not shown) havinga predetermined shape is formed on the surface of the copper foil 409stuck to the upper and lower sides of the insulating layer 402. Thecopper foil 409 is then etched with an etching solution such as ferricchloride solution and cupric chloride solution. The etching resist isthen removed to obtain a both-sided circuit board 410 having an upperelectrically-conductive layer 403 and a lower electrically-conductivelayer 404 formed thereon.

Subsequently, as shown in FIG. 58C, using a punching die, NC drillmachine, laser machining tool or the like, a conductor press-fit hole406 is formed extending through the upper electrically-conductive layer403, the insulating layer 402 and the lower electrically-conductivelayer 404 (conductor press-fit hole forming step).

Subsequently, as shown in FIG. 58D, a conductor 407 in the form ofsubstantial sphere is press-fitted into the conductor press-fit hole 406of the both-sided laminated board 410 by the pressing portion 411(conductor press-fitting step).

The conductor 407 is formed by solder, copper alloy or the like. Themaximum diameter of the conductor 407 is from not smaller than 1.1 timesto not greater than 1.8 times the diameter of the conductor press-fithole 406. Referring to the reason for this limitation, it was found thatas the maximum diameter of the conductor 407 decreases from 1.1 timesthe diameter of the conductor press-fit hole 406, it becomes moredifficult for the conductor 407 to fill the interior of the interlayerconnection portion compactly and deform the conductor press-fit hole 406to cone shape. On the contrary, as the maximum diameter of the conductor407 increases from 1.8 times the diameter of the conductor press-fithole 406, it becomes more difficult for the conductor 407 to bepress-fitted into the conductor press-fit hole 406. Further, theinterlayer connection portion 405 thus formed by press-fitting is raisedon the wider end thereof, making it difficult to laminate anotherflexible print circuit board thereon. The conductor 407 thus formed isthen press-fitted into the conductor press-fit hole 406 of theboth-sided circuit board 410 by the pressing portion 411 to form acone-shaped interlayer connection portion 405 as shown in FIG. 58E.

The flexible print circuit board 4001 according to Embodiment 10 and itsproducing method have the aforementioned constitution and thus have thefollowing advantages.

(1) Since the interlayer connection portion 405 comprises the conductor407 electrically connecting between the upper side of the upperelectrically-conductive layer 403 and the surface of the upperelectrically-conductive layer 403 on the conductor press-fit hole 406side thereof and the surface of the lower electrically-conductive layer404 on the conductor press-fit hole 406 side thereof, the contact areaof the interlayer connection portion 405 with the upperelectrically-conductive layer 403 is so great as to enhance thereliability in electrical connection.

(2) Since the interlayer connection portion 405 is in the form of cone,the stress in the thickness direction due to thermal expansion can berelaxed, making it possible to prevent the exfoliation at the connectioninterface due to heating.

(3) Since the conductor 407 is formed by solder, copper alloy or thelike, the ductility of such a metal makes it easy for the conductor 407to be deformed into cone. It is thus assured that the conductor 407 cancome in close contact with the upper electrically-conductive layer 403and the lower electrically-conductive layer 404 to connect between thetwo electrically-conductive layers. At the same time, the conductor 407formed by such a metal can be difficultly oxidized and thus can enhancethe reliability in electrical connection.

(4) Since the interlayer connection portion 405 is formed after theetching of the upper and lower copper foils 409 on the insulating layer402 resulting in the formation of the upper electrically-conductivelayer 403 and the lower electrically-conductive layer 404, theinterlayer connection doesn't cause the rise of the thickness of theupper electrically-conductive layer 403 and the lowerelectrically-conductive layer 404 unlike related art plated through-holemethod, allowing finer conductor pattern and hence providing highercircuit density.

(5) Since the interlayer connection portion 405 can be formed merely byforming a conductor press-fit hole 406 and then press-fitting theconductor 407 into the conductor press-fit hole 406, a flexible printcircuit board having a high reliability in electrical connection can beproduced by a simple method involving a few steps.

(6) Since the maximum diameter of the substantially spherical conductor407 is from not smaller than 1.1 times to not greater than 1.8 times thediameter of the conductor press-fit hole 406, the press-fitting of theconductor 407 makes it possible to deform the conductor press-fit hole406 into cone and fill the interior of the interlayer connection portion405 compactly. At the same time, it is not likely that the surface ofthe interlayer connection portion thus formed by press-fitting can beraised on the wider end thereof, making it possible to laminate anotherflexible print circuit board thereon. Further, the resultingself-alignment action makes it easy to position the conductor 407 at thecenter of the conductor press-fit hole 406.

Embodiment 11

FIG. 59 is a side sectional view of an essential part of a flexibleprint circuit board according to Embodiment 11.

In FIG. 59, the flexible print circuit board 4001 a according toEmbodiment 11 differs from the flexible print circuit board 4001according to Embodiment 10 in that the insulating layer 402 having theupper electrically-conductive layer 403 a formed thereon and theinsulating layer 402 having the lower electrically-conductive layer 404a formed thereon are laminated on each other with an adhesive layer 414with the insulating layers 402 opposed to each other and the conductor407 a is press-fitted in the cone-shaped conductor press-fit hole 406 aformed in the interlayer connection portion 405 a extending between theupper electrically-conductive layer 403 a and the lowerelectrically-conductive layer 404 a.

A method of producing the flexible print circuit board 4001 a accordingto Embodiment 11 having the aforementioned constitution will bedescribed hereinafter in connection with the attached drawings.

FIG. 60A is a side sectional view of an essential part of a one-sidedcopper-clad laminated board to be used in the production of the flexibleprint circuit board according to Embodiment 2. FIG. 60B is a sidesectional view of an essential part illustrating a both-sided circuitboard forming step. FIG. 60C is a side sectional view of an essentialpart illustrating a both-sided circuit board.

In FIG. 60, the reference numeral 412 indicates a one-sided copper-cladlaminated board. The reference numeral 413 and 413 a each indicate aone-sided circuit board having an upper electrically-conductive layer403 a and a lower electrically-conductive layer 404 a formed thereon byetching the copper foil 409 on the one-sided copper-clad laminated board412 so that a predetermined conductor pattern is formed. The referencenumeral 414 indicates an adhesive layer with which the one-sided circuitboards 413 and 413 a are bonded to each other with the insulating layers402 opposed to each other.

Firstly, as shown in FIG. 60A, two sheets of one-sided copper-cladlaminated boards 412 having a copper foil 409 formed on one side of aninsulating layer 402 are prepared.

Subsequently, as shown in FIG. 60B, one-sided circuit boards 413 and 413a having an upper electrically-conductive layer 403 a and a lowerelectrically-conductive layer 404 a formed thereon by etching in thesame manner as in Embodiment 10, respectively, are laminated on eachother with an adhesive layer 414 with the insulating layers 402 opposedto each other (both-sided circuit board forming step). In this manner, aboth-sided circuit board 410 a as shown in FIG. 60C can be obtained. Ingeneral, a one-sided circuit board allows finer conductor pattern than aboth-sided circuit board. This is because the formation of a conductorpattern on a one-sided circuit board is accomplished merely by sprayingthe etching solution onto the one-sided circuit board only on the lowerside thereof, causing no stagnation of the etching solution and allowingoptimization of the etching conditions.

Subsequently, the both-sided circuit board 410 a is subjected toconductor press-fit hole forming step and conductor press-fitting stepdescribed in Embodiment 10 to obtain a flexible print circuit board 401a.

The flexible print circuit board 401 a according to Embodiment 11 andits producing method have the aforementioned constitution and thus havethe following advantage in addition to the advantages of Embodiment 10.

(1) Since the one-sided circuit boards 413 and 413 a allowing fineconductor pattern are laminated on each other with the insulating layers402 opposed to each other to form the both-sided circuit board 410 a,the flexible print circuit board 4001 a can be obtained by a simplemethod involving a few steps.

Embodiment 12

FIG. 61 is a sectional view of an essential part of a flexible printcircuit board according to Embodiment 12.

In FIG. 61, the flexible print circuit board 4001 b according toEmbodiment 12 differs from the flexible print circuit board 4001 aaccording to Embodiment 11 in that the insulating layer 402 having anupper electrically-conductive layer 403 a formed thereon and theinsulating layer 402 having an inner electrically-conductive layer 415are laminated on each other with an adhesive layer 414 in such anarrangement that the former insulating layer 402 is opposed to the innerelectrically-conductive layer 415, the cone-shaped conductor press-fithole 406 b is formed in the interlayer connection portion 405 bextending between the upper electrically-conductive layer 403 a and theinner electrically-conductive layer 415 and the conductor 407 bpress-fitted in the conductor press-fit hole 406 b of the interlayerconnection portion 405 b electrically connects between the upper side ofthe upper electrically-conductive layer 403 a and the side surface ofthe upper electrically-conductive layer 403 a on the conductor press-fithole 406 b side thereof and the surface of the innerelectrically-conductive layer 415.

A method of producing the flexible print circuit board 4001 b accordingto Embodiment 12 having the aforementioned constitution will bedescribed hereinafter in connection with the attached drawings.

FIG. 62A is a side sectional view of an essential part illustrating anadhesive layer forming step. FIG. 62B is a side sectional view of anessential part illustrating a conductor press-fit hole forming step.FIG. 62C is a side sectional view of an essential part illustrating aone-sided circuit board sticking step. FIG. 62D is a side sectional viewof an essential part illustrating a conductor press-fitting step. FIG.62E is a side sectional view of an essential part illustrating how theconductor is press-fitted into the conductor press-fit hole.

In FIG. 62, the reference numeral 406 b indicates a conductor press-fithole extending through the one-sided circuit board 413 and the adhesivelayer 414.

Firstly, as shown in FIG. 62A, the adhesive layer 414 is formed on thesurface of the one-sided circuit board 413 on the insulating layer sidethereof (adhesive layer forming step).

Subsequently, as shown in FIG. 62B, using a punching die, NC drillmachine, laser machining tool (not shown) or the like, a conductorpress-fit hole 406 is formed extending through the upperelectrically-conductive layer 403 a and the adhesive layer 414(conductor press-fit hole forming step).

Subsequently, as shown in FIG. 62C, on the one-sided circuit board 413is laminated the other one-sided circuit board 413 b on the innerelectrically-conductive layer 415 side thereof with the adhesive layer414 (one-sided circuit board laminating step).

Subsequently, as shown in FIG. 62D, a conductor 407 b in the form ofsubstantial sphere is press-fitted into the conductor press-fit hole 406b by the pressing portion 411 (conductor press-fitting step). By theconductor 407 b being press-fitted into the conductor press-fit hole 40b by the pressing portion 411, a cone-shaped interlayer connectionportion 405 b is formed as shown in FIG. 62E.

The flexible print circuit board 4001 b according to Embodiment 12 andits producing method have the aforementioned constitution and thus havethe following advantage in addition to the advantages of Embodiment 10or 11.

(1) Since the one-sided circuit boards 413 and 413 b are laminated oneach other with the adhesive layer 414 and the conductor 407 b ispress-fitted into the conductor press-fit hole 406 b to form theinterlayer connection portion 405 b, the upper side of the upperelectrically-conductive layer 403 a and the side surface of the upperelectrically-conductive layer 403 a on the conductor press-fit hole 406b side thereof and the surface of the inner electrically-conductivelayer 415 can be electrically connected to each other, making itpossible to raise the contact area thereof and enhance the reliabilityin electrical connection. Further, the flexible print circuit board 4001b having circuits formed at a high density can be obtained by a simplemethod involving a few steps, making it possible to attain theenhancement of circuit density and productivity at the same time.

Embodiment 13

FIG. 63A is a side sectional view of an essential part of amulti-layered flexible print circuit board according to Embodiment 4.FIG. 63B is a side sectional view of an essential part illustrating amodification of the multi-layered flexible print circuit board.

In FIG. 63, the reference numeral 416 indicates a multi-layered flexibleprint circuit board according to Embodiment 13. The reference numeral416 a indicates a modification of the multi-layered flexible printcircuit board 416 as a modification of Embodiment 13.

A method of producing the multi-layered flexible print circuit board 416according to Embodiment 13 will be described hereinafter.

Two sheets of the flexible print circuit boards 4001 according toEmbodiment 10 and the flexible print circuit board 4001 b according toEmbodiment 12 are laminated on each other with an adhesive layer 414,respectively (bonding/laminating step). In this manner, themulti-layered flexible print circuit board 416 can be obtained. Bychanging the position of lamination of these boards, the multi-layeredflexible print circuit board 416 a can be obtained.

The multi-layered flexible print circuit board 416 according toEmbodiment 13 and its producing method have the aforementionedconstitution and thus have the following advantage in addition to one ofthe advantages of Embodiments 10 to 12.

(1) The lamination of the flexible print circuit boards 4001 and 4001 bhaving a high reliability in electrical connection and a fine conductorpattern makes it possible to obtain multi-layered flexible print circuitboards 416 and 416 a having a high reliability in electrical connectionand a high density circuit by a simple method involving a few steps.

Embodiments 14 and 15

One mode of embodiment of the invention is described in the followingwith reference to FIG. 64 to FIG. 67. In these drawings, the identicalmembers are designated by common reference numerals, and theiroverlapped descriptions are omitted. Moreover, the materials and thenumerical values, as specified in the embodiment, are just those, whichcan be variously selected, and should not be limited thereto.

First of all, double-sided FPCs according to the embodiments of theinvention are described with reference to FIG. 64. FIG. 64(a) is asectional view of an essential portion of a double-sided FPC accordingto Embodiment 14 of the invention, and FIG. 64(b) is a sectional view ofan essential portion of a double-sided FPC according to Embodiment 15 ofthe invention.

In FIG. 64(a), the double-sided FPC 501 of Embodiment 14 is constitutedsuch that a wiring upper layer 503 and a wiring lower layer 504 areformed on the two faces of an insulating layer 502 made of a polyimidefilm. The layer connection between the individual wiring layers 503 and504 is made by a conductor 506, which is filled and press-fitted in aconductor press-fit hole 505 of a through hole.

As shown in FIG. 64(a), the wiring upper layer 503 for the layerconnection of the double-sided FPC 501 has a constitution, which isdepressed along the wall face from the expanded side of the conductorpress-fit hole 505 having a cone shape. As a result, the contact areabetween the wiring upper layer 503 and the conductor 506 is increased toprovide a high contact strength. Therefore, it is possible to providethe double-sided FPC having a high connection reliability.

As in the double-sided FPC 507, as shown in FIG. 64(b), the wiring upperlayer 503 and the wiring lower layer 504 are formed on the two faces ofthe insulating layer 502, and the layer connection between theindividual wiring layers 503 and 504 is made through the conductor 506,which is filled and press-fitted in a conductor press-fit hole 508.

As shown in FIG. 64(b), the wiring upper layer 503 and the wiring lowerlayer 504 for the layer connection of the double-sided FPC 507 have aconstitution, which is depressed along the wall face from the expandedsides of the conductor press-fit hole 508 having a drum shape. As aresult, the contact areas between the wiring upper and lower layers 503and 504 and the conductor 506 can be increased to provide a highercontact strength. Therefore, it is possible to provide the double-sidedFPC having a higher connection reliability.

Here, it is preferred that the conductor 506 is made of a soft metalsuch as copper, aluminum, tin, iron, gold or silver, or their alloy.This is because the conductor 506 can be deformed to contact with thewiring layer, which is depressed along the wall face of the conductorpress-fit hole, without any clearance by the high spreading propertiesof that soft metal so that the conductor 506 having a high contactstrength to the wiring layers thereby to improve the connectionreliably. Of those metals, copper or its alloy has a satisfactoryconsistency of a coefficient of thermal expansion to the insulatinglayer so that the coefficient of thermal expansion of the conductor 506can be effectively optimized to retain a high connection reliability.Therefore, the copper or its alloy is the most preferable as thematerial for the conductor 506.

It is further preferred that the conductor 506 is coated on its metalmember surface with a solder material such as eutectic solder,high-temperature solder or lead-free solder. This is because theconductor surface is coated with the solder material so that the wiringlayer surfaces, with which the conductor contacts, and the surface ofthe conductor can be firmly connected to form the conductor having ahigh contact strength to the wiring layers thereby to provide a higherconnection reliability. Any of those constitutions of the conductor maybe suitably and properly adopted but should not be limited thereto.

Next, the method for manufacturing the double-sided FPC having such highconnection reliability is described in more detail with reference toFIG. 65(a) to FIG. 65(h), FIG. 66(a) to FIG. 66(i) and FIG. 67.

At first, a method for manufacturing the double-sided FPC in Embodiment14 of the invention is described with reference to FIG. 65(a) to FIG.65(h). FIG. 65(a) is a sectional view of an essential portion of adouble-sided copper-clad laminate or a raw material in this embodimentof the invention; FIG. 65(b) is a sectional view of an essential portionof the double-sided copper-clad laminate, in which wiring layers areformed, in this embodiment of the invention; FIG. 65(c) is a sectionalview of an essential portion of the double-sided copper-clad laminate,in which a through hole is formed, in this embodiment of the invention;FIG. 65(d) is a sectional view of an essential portion of thedouble-sided copper-clad laminate, in which a generally sphericalconductor is arranged, in this embodiment of the invention; FIG. 65(e)is a sectional view of an essential portion of the double-sidedcopper-clad laminate, in which the generally spherical conductor ispress-fitted, in this embodiment of the invention; FIG. 65(f) is asectional view of an essential portion of the double-sided copper-cladlaminate, in which solder particles are filled, in this embodiment ofthe invention; FIG. 65(g) is a sectional view of an essential portion ofthe double-sided copper-clad laminate, in which the solder particles aremelted, in this embodiment of the invention; and FIG. 65(h) is asectional view of an essential portion of the double-sided FPC, afterlayer-connected, in this embodiment of the invention.

At first, as shown in FIG. 65(a), there is prepared a double-sidedcopper-clad laminate 509, in which copper foils 510 are formed directlyon the two faces of the insulating layer 502. Here in Embodiment 14 ofthe invention, there is enumerated the two-layer type having no adhesivelayer between the insulating layer 502 and the copper foils 510. It is,however, possible to use a three-layer type having the adhesive layers.Either type may be suitably and properly used, and should not be limitedthereto.

Next, as shown in FIG. 65(b), a mask material is formed on the surfaceof the copper foils 510 and is etched with an etching liquid of coppersuch as iron chloride or copper chloride, thereby to obtain adouble-sided wiring board 511. The wiring layers thus formed are notsubjected to any influence at the subsequent steps. In the method ofmanufacturing the double-sided FPC 501 according to the embodiments ofthe invention, therefore, the final shape of the wiring layers isspecified till the wiring layer forming step, so that the wiring layersare refined.

As shown in FIG. 65(c), moreover, a through hole 512 is formed in thelayer connection by a through holing work using a punching mold 513. Asshown in FIG. 65(d), a suction board 515 is used to perform theevacuation from the side of the through hole 512, and a generallyspherical conductor 514 having a larger diameter than that of thethrough hole is arranged on one opening of the through hole 512. Asshown in FIG. 65(e), the double-sided wiring board 511 is placed on apressing bottom plate 518, and a pressing top plate 517 is moved andpressed downward to press-fit the generally spherical conductor into thethrough hole 512 and to depress the wiring upper layer 503 along thethrough hole wall thereby to fit and form a conducting member 516press-fitted and the depressed portion of the wiring upper layer 503firmly in the conical conductor press-fit hole 505. The conductingmember 516 thus obtained is so shaped that the wiring upper layer 503contacting is depressed along the conductor press-fit hole wall. As aresult, the contact area can be increased to provide the high contactstrength and to retain the high connection reliability.

In the double-sided FPC manufacturing method in Embodiment 14 of theinvention, therefore, the generally spherical conductor having a largerdiameter than the through hole diameter is press-fitted in the throughhole 512 so that the wiring layer can be conveniently deformed along theconductor press-fit hole wall thereby to form the highly reliable layerconnection having the wiring layer depressed on the conductor press-fithole wall, by the remarkably simple process.

Next, as shown in FIG. 65(f), the double-sided wiring board 11 is turnedover, and the other opening of the conductor press-fit hole 505 isfilled with solder particles 519. As shown in FIG. 65(g), a hot plate520 is then used to melt and solidify the solder particles 519, therebyto form the conductor 506, which is firmly jointed to the wiring lowerlayer 504.

By the process thus far described, as shown in FIG. 65(h), thedouble-sided FPC 501 of a high connection reliability having the wiringlayer depressed in the conductor press-fit hole wall can be obtained bythe remarkably simple process.

In the double-sided FPC manufacturing method thus attained in Embodiment14 of the invention, the layer connection is made at first after thewiring layers were formed, so that the process does not exert noinfluence upon the wiring upper layer but suits the miniaturization ofthe wiring layers. Moreover, the layer connection has the wiring layerdepressed in the conductor press-fit hole wall, and the other wiringlayer surface is partially coated and jointed, so that the highconnection reliability is obtained. As the layer jointing method,moreover, the layer connection having the high connection reliability ismade by the remarkably simple process of press-fitting the generallyspherical conductor, filling the solider particles, and melting andsolidifying steps, so that the step number is reduced in comparison withanother layer connecting method thereby to improve the productivitydrastically. As a result, it is possible to provide the double-sidedFPC, which is the most proper for miniaturizing the wiring layers, whichis high in connection reliability and which has a layer connection of anexcellent productivity.

Here, it is preferred that the conducting member 516 constituting theconductor 506 contains copper or its alloy. This is because theconductor contains the copper or its alloy having an excellentconsistency of the coefficient of thermal expansion to the insulatinglayer 502, so that the coefficient of thermal expansion of the conductorcan be effectively optimized to retain a higher connection reliability.

Moreover, the conducting member 516 may contain the same material asthat of the solder particles. This is because the conducting membercontains the same material as that of the solder particles so that thecompatibility between the conducting member and the solder particles isso excellent, when the solder particles are melted and solidified, as toprovide a strong joint.

Moreover, the conducting member 516 may be made of the same material asthat of the solder particles. This is also because the conducting memberand the solder particles are of the common material so that thecompatibility between the conducting member and the solder particles isso excellent, when the solder particles are melted and solidified, as toprovide the strong joint. Moreover, the difference in the coefficient ofthermal expansion between the solder metal and the insulating layer canbe relaxed by the connected portion deformed into the cone shape so thatthe high connection reliability is retained. Any of those materials ofthe conducting member may be suitably and properly used, and should notbe limited thereto.

Next, the method for manufacturing the double-sided FPC, in Embodiment15, excellent in a high connection reliability and in a miniaturizationof wiring layers is described in more detail with reference to FIG.66(a) to FIG. 66(i). FIG. 66(a) is a sectional view of an essentialportion of a single-sided copper-clad laminate or a raw material inEmbodiment 15 of the invention; FIG. 66(b) is a sectional view of anessential portion of the single-sided copper-clad laminate, in which awiring layer is formed, in this embodiment of the invention; FIG. 66(c)is a sectional view of an essential portion of a double-sidedcopper-clad laminate, in which the single-sided laminates are adhered,in this embodiment of the invention; FIG. 66(e) is a sectional view ofan essential portion of the double-sided copper-clad laminate, in whicha through hole is formed, in this embodiment of the invention; FIG.66(e) is a sectional view of an essential portion of the double-sidedcopper-clad laminate, in which a generally spherical conductor isarranged, in this embodiment of the invention; FIG. 66(f) is a sectionalview of an essential portion of the double-sided copper-clad laminate,in which the generally spherical conductor is press-fitted, in thisembodiment of the invention; FIG. 66(g) is a sectional view of anessential portion of the double-sided copper-clad laminate, in which agenerally spherical solder member is press-fitted, in this embodiment ofthe invention; FIG. 66(h) is a sectional view of an essential portion ofthe double-sided copper-clad laminate, in which the generally sphericalsolder member is press-fitted, in this embodiment of the invention; andFIG. 66(i) is a sectional view of an essential portion of thedouble-sided FPC, after layer-connected, in this embodiment of theinvention.

At first, a single-sided copper-clad laminate 521 having the copper foil510 formed directly on the single side of the insulating layer 502 isprepared, as shown in FIG. 66(a). As shown in FIG. 66(b), the wiringupper layer 503 is formed by an etching treatment to attain asingle-sided wiring board 522. As compared with the wiring layers of theaforementioned double-sided wiring board, the wiring upper layer 3 ofthe single-sided wiring board 522 obtained can be etched on its singleside suitably for the miniaturization so that it can be further refined.

This is reasoned in the following. Usually in the formation of thewiring layers of the double-sided wiring board, the etching liquid hasto be applied homogeneously without any irregularity vertically of thedouble-sided copper-clad laminate so that the copper foils on the doublefaces of the double-sided copper-clad laminate may be simultaneouslyetched. In case, however, the etching liquid is pressurized and sprayedvertically of the double-sided copper-clad laminate, there arises aproblem that the etching liquid after sprayed to the upper face isaccumulated on the upper face so that the etching homogeneity cannot beretained. Therefore, the etching conditions are so unstable on thedouble-sided wiring board as to make it difficult to form the remarkablyfine wiring layers. In the formation of the wiring layer of thesingle-sided wiring board, on the other hand, the spray may be done onlyfrom the lower side so that the etching liquid is not accumulated towiden the optical range of the etching conditions. Thus, thesingle-sided wiring board is suited for the miniaturization of thewiring layer.

Next, as shown in FIG. 66(c), the single-sided wiring board 522 and theother single-sided wiring board 523 are so adhered to each other throughan adhesive layer 525 that the wiring layers are the outermost layers,thereby to provide a laminated wiring board 524. The laminated wiringboard 524 thus obtained is a laminate of the single-sided wiring boardshaving the fine wiring layers so that their wiring layers are finer thanthose of the aforementioned double-sided wiring board.

Next, as shown in FIG. 66(d), by the through hole working step using thepunching mold 513, the through hole 512 is formed in the layerconnection of the laminated wiring board 524. As shown in FIG. 66(e),the generally spherical conductor 514 having a larger diameter than thethrough hole diameter is then arranged in the through hole 512. As shownin FIG. 66(f), a press is used to press-fit the generally sphericalconductor in the through hole to depress the wiring upper layer 503along the through hole wall thereby to bring the press-fitted conductingmember 516 and the depressed portion of the wiring upper layer 503 intoclose contact with each other.

As shown in FIG. 66(g), moreover, the laminated wiring board 524 isturned back, and a generally spherical solder member 527 is arranged inthe other opening of the conductor press-fit hole. Into the method forarranging the generally spherical solder member, there can be convertedthe known method, as called the “BGA (Ball Grid Array)”, for mountingthe solder balls in the semiconductor package. Specifically, there isprepared a suction plate, which is provided with a radially smallersuction hole than the solder ball at a position corresponding to thethrough hole, and a vacuum pump is connected for adjusting the pressurein the suction hole. This suction plate is used to such the solder ballinto the suction port. The solder ball is dropped in alignment on theother opening of the through hole so that it is disposed on the otheropening of the through hole. Thus, it is possible to use the facilitiescalled the “ball mounter” for performing the operations thus fardescribed. Here has been exemplified the example for mounting the solderball by the evacuation, but another method using an electrostaticsuction or a metal mask can also be used. Either of them can be suitablyand properly used, but should not be limited thereto.

Next, as shown in FIG. 66(h), a generally spherical solder member 28 ispress-fitted in the conductor press-fit hole by using a press. Thewiring lower layer 504 is depressed along the conductor press-fit holewall thereby to bring the solder member 528 press-fitted, the depressedportion of the wiring lower layer 504 and the conducting member 516press-fitted in advance into close contact. The layer connection thusobtained has a shape, in which both the upper and lower wiring layersare depressed along the conductor press-fit hole wall. As a result, thecontact area with the conductor can be further increased to attain ahigh contact strength thereby to improve the connection reliability. Inthe method of manufacturing the double-sided FPC according to Embodiment3 of the invention, therefore, the generally spherical solder member toact as the conductor is press-fitted in the through hole so that theupper and lower wiring layers can be depressed along the conductorpress-fit hole wall thereby to provide the layer connection having thehigh connection reliability.

Finally, there is obtained the double-sided FPC 526, which islayer-connected by the conductor 506 formed by melting and solidifyingthe solder member 528, as shown in FIG. 66(i).

The double-sided FPC manufacturing method thus obtained according toEmbodiment 15 of the invention forms the double-sided FPC by laminatingthe single-sided wiring boards so that the wiring layers become finerthan those of the double-sided wiring board. By the remarkably simpleprocess of press-fitting the generally spherical solder member in thethrough hole, moreover, even the wiring lower layer existing on thepress-fit side of the generally spherical solder member is depressedalong the through hole wall so that the layer connection having theupper and lower wiring layers depressed in the conductor press-fit holewall can be formed to provide the higher connection reliability.According to this embodiment, too, it is possible to provide thedouble-sided FPC, which is high in the connection reliability, which isthe most proper for miniaturizing the wiring layers, and which has thelayer connection of an excellent productivity.

Finally, a double-sided FPC, which is further laminated from theaforementioned double-sided FPC, according to an embodiment of theinvention is described with reference to FIG. 67. FIG. 67(a) is asectional view of a multi-layer FPC laminated according to furtherembodiment of the invention, and FIG. 67(b) is a sectional view of amulti-layer FPC laminated according to further embodiment of theinvention.

At first, the double-sided FPCs manufactured according to Embodiment 3of the invention are further laminated through the adhesive layer 525,as shown in FIG. 67(a), to provide a multi-layer FPC 529 having anincreased number of wiring layers. The multi-layered FPC 529 thusobtained is high in the connection reliability and excellent in theminiaturization of the wiring layers, because the double-sided FPCs orthe constitution materials have the high connection reliability and thefine wiring layers.

As shown in FIG. 67(b), on the other hand, the multi-layer FPC 529 isobtained by laminating the aforementioned double-sided FPCs 501 suchthat their conductors 506 are jointed to each other. Since the soldermaterial exists on the surfaces of the conductors 506, they are meltedand solidified, if the conductors 506 are heated and cooled in contactwith each other, so that the conductors 506 are simply jointed.

The multi-layer FPCs thus obtained according to the above mentionedembodiments are formed by further laminating the double-sided FPCshaving the high connection reliability and the fine wiring layers, sothat they are high in the connection reliability and excellent in theminiaturization of the wiring layers. Moreover, the aforementionedconductors are also used for the layer connection of the multi-layeredFPC so that a higher productivity can be attained without using any newlayer connection material. According to these Embodiments, it is alsopossible to provide the multi-layer FPC, which is high in the connectionreliability, which is optimum for the miniaturization of the wiringlayers and which has the layer connection excellent in the productivity.

While the invention has been described in detail and with reference tospecific embodiments thereof, it will be apparent to one skilled in theart that various changes and modifications can be made therein withoutdeparting from the spirit and scope thereof. As mentioned above, inaccordance with the invention, a multi-layered FPC having a highconnection reliability and a high producibility which is most suitablefor fineness of circuit layers and its producing method can be provided.

The present application is based on Japanese Patent Application2004-305493, filed on Oct. 20, 2004, Japanese Patent Application2004-305594, filed on Oct. 20, 2004, Japanese Patent Application2004-313593, filed on Oct. 28, 2004, Japanese Patent Application2004-342221, filed on Nov. 26, 2004, and Japanese Patent Application2006-007086 filed on Jan. 16, 2006, and is hereby incorporated byreference.

1. A method for manufacturing a double-sided flexible printed wiringboard, comprising: a wiring board forming step of forming a wiring boardhaving wiring layers on both the faces of an insulating layer; aconductor press-fit hole forming step of forming such a through hole insaid wiring board in the thickness direction of the same as to connectsaid wiring layers on the two faces; a conductor press-fitting step forpress-fitting a generally spherical conductor having a larger diameterthan that of said conductor press-fit hole into said conductor press-fithole thereby to expand and deform the wiring layer around said conductorpress-fit hole on the press-fit side, to the outside and to joint saidwiring layer expanded to the outside, and the conductor to each other;and a solder member forming step of feeding particle solder members in apredetermined quantity into the conductor press-fit hole on the sideopposite to said press-fit side, and melting and solidifying said soldermembers thereby to joint said conductor filled and press-fitted in saidconductor press-fit hole and to joint the wiring layer around saidconductor press-fit hole on the opposite side.
 2. A method formanufacturing a double-sided flexible printed wiring board, comprising:a wiring board forming step of forming a wiring board having wiringlayers on both the faces of an insulating layer; a conductor press-fithole forming step of forming such a through hole in said wiring board inthe thickness direction of the same as to connect said wiring layers onthe two faces; a conductor press-fitting step for press-fitting agenerally spherical conductor having a larger diameter than that of saidconductor press-fit hole into said conductor press-fit hole thereby toexpand and deform the wiring layer around said conductor press-fit holeon the press-fit side, to the outside and to joint said wiring layerexpanded to the outside, and the conductor to each other; and a soldermember forming step of feeding a generally spherical particle soldermember from the conductor press-fit hole on the side opposite to saidpress-fit side, expanding and deforming the wiring layer around saidconductor press-fit hole on the press-fit side of the solder member tothe outside, and melting and solidifying said solder members thereby tojoint said conductor filled and press-fitted in said conductor press-fithole and to joint the wiring layer around said conductor press-fit holeon the solder member press-fit side.
 3. A double-sided flexible printedwiring board manufacturing method as set forth in claim 1, wherein saidconductor contains copper or its alloy.
 4. A double-sided flexibleprinted wiring board manufacturing method as set forth in claim 1,wherein said conductor contains a material identical to that of saidsolder member.
 5. A double-sided flexible printed wiring boardmanufacturing method as set forth in claim 1, wherein said wiring boardforming step includes: the single-sided wiring board forming step offorming two single-sided wiring boards having a wiring layer formed onone face of the insulating layer; and the step of adhering said twosingle-sided wiring boards through an adhesive layer such that saidwiring layers are located on the outer side.
 6. A method formanufacturing a multi-layer flexible printed wiring board, characterizedby comprising the adhering and laminating step of laminating a pluralityof double-sided flexible printed wiring boards prepared by themanufacturing method as set forth in claim 1, through an adhesive layer.7. A double-sided flexible printed wiring board manufacturing method asset forth in claim 2, wherein said conductor contains copper or itsalloy.
 8. A double-sided flexible printed wiring board manufacturingmethod as set forth in claim 2, wherein said conductor contains amaterial identical to that of said solder member.
 9. A double-sidedflexible printed wiring board manufacturing method as set forth in claim2, wherein said wiring board forming step includes: the single-sidedwiring board forming step of forming two single-sided wiring boardshaving a wiring layer formed on one face of the insulating layer; andthe step of adhering said two single-sided wiring boards through anadhesive layer such that said wiring layers are located on the outerside.
 10. A method for manufacturing a multi-layer flexible printedwiring board, characterized by comprising the adhering and laminatingstep of laminating a plurality of double-sided flexible printed wiringboards prepared by the manufacturing method as set forth in claim 2,through an adhesive layer.